A kind of anti-moisture protection process method for flip-chip soldering
A process method and flip-chip welding technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid-state devices, etc., can solve the problems of flip-chip solder joint corrosion and affect circuit performance, and improve moisture resistance and moisture resistance Ability, strength-enhancing effects
Active Publication Date: 2017-12-01
BEIJING MXTRONICS CORP +1
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Problems solved by technology
[0004] However, when the above-mentioned flip-chip package structure is in a high-humidity external environment, water vapor can easily penetrate into the interior from the filler 4, causing corrosion of flip-chip solder joints, and ultimately affecting circuit performance
Method used
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Experimental program
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Embodiment 1
[0037] Step (1), using a 2060-type vacuum coating machine, first dry the flip-chip welding circuit, then put it into the vacuum chamber of the 2060-type vacuum coating machine, and evacuate it to make the vacuum degree reach 15mTorr;
[0038] Step (2), the perfluoroparylene is loaded into the cracking chamber of the 2060-type vacuum coating machine; the perfluoroparylene is heated to make its temperature reach 670 ° C; the valve in the cracking chamber is opened to make the The perfluorinated parylene material enters the vacuum chamber through the diffusion conduit and is deposited on the surface of the integrated circuit on the shelf. During the deposition process, the vacuum degree in the vacuum chamber is controlled within 50 ± 2mTorr, and the temperature in the vacuum chamber is 30°C;
[0039] Step (3), when the vacuum degree in the vacuum chamber drops to 15mTorr, close the valve of the cracking chamber to complete the evaporation of the coating.
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The invention provides a moisture-resistant protection technological method for flip chip bonding. The method comprises steps as follows: a circuit is dried; the circuit is put in a vacuum coating machine for vacuum pumping treatment; a coating material is loaded and heated; the circuit is subjected to vacuum coating; epoxy resin is filled; after the treatment, the welding spot surface of a package structure, the lower surface of a chip and the upper surface of a substrate are coated with the coating material; by means of a film, the moisture-resistant protection property of a flip chip bonding packaging structure is greatly improved, and the welding spot strength is improved. The technology is mainly applied to a non-airtightness flip chip bonding packaging process, completeness of non-airtightness flip chip bonding circuit protection can be guaranteed, and a protection layer with good uniformity can be obtained.
Description
technical field [0001] The invention belongs to the technical field of protection, and in particular relates to a flip-chip moisture-resistant protection process, which is suitable for the flip-chip packaging process. Background technique [0002] The flip-chip welding process is a direct interconnection process with the front of the chip facing down. First, metal bumps are made on the metal pad of the chip, and then the active side of the chip faces down, so that the bumps on the chip and the bumps on the substrate The metal pads are aligned, and the chip and the substrate form a stable and reliable mechanical connection and electrical connection through heating or pressure. The two-dimensional interconnection density can be maximized by using the flip-chip bonding process. At the same time, since the metal pad can be placed on the entire surface of the chip, on the same chip area, compared with the conventional wire bonding process, the metal pad has less The density and ...
Claims
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IPC IPC(8): H01L21/56
CPCH01L21/563H01L2224/73204H01L2224/8192
Inventor 赵元富姚全斌李京苑练滨浩熊盛阳黄颖卓姜学明田玲娟林鹏荣
Owner BEIJING MXTRONICS CORP