High-speed avalanche photodetector chip with carrier and manufacturing method for high-speed avalanche photodetector chip
A detector chip, avalanche photoelectric technology, applied in the field of optical transmission network, can solve the problems of difficult to achieve receiving sensitivity, low chip coupling efficiency, reduced capacitance and chip distribution parameters, etc., to reduce the overall distribution parameters, improve the chip transmission rate, The effect of improving the reception sensitivity
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[0032] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0033] see Figure 4 to Figure 7 , the present invention provides a high-speed avalanche photodetector chip with a carrier, which is mainly composed of three parts, specifically including: a carrier 13, several solder balls 12 welded on the carrier 13, and soldered to the carrier in a flip-chip manner. The epitaxial wafer 40 on several welding balls 12, the carrier 13 is a ceramic carrier, and a metal pattern is formed on its surface, and the radius R1 of the welding ball 12 is greater than 10um and less than 50um, which can ensure that after welding, the epitaxial wafer 40 and The distance D3 between the carriers 13 is larger than 10um. The epitaxial wafer 40 includes: a substrate 18, a buffer layer 19 formed on the substrate 18, an absorption layer 20 formed on the buffer layer 19, a transition layer 21 formed on the absorption layer 20, ...
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