Stacked-array liquid refrigeration type high-power semiconductor laser

Abstract

The invention provides a stacked-array liquid refrigeration type high-power semiconductor laser, and particularly relates to a macro channel liquid refrigeration stacked-array semiconductor laser. The stacked-array liquid refrigeration type high-power semiconductor laser comprises a lower water drainage block, an insulation sheet a, a positive electrode, a semiconductor laser module, a negative electrode, an insulation sheet b and an upper water drainage block, and the lower water drainage block, the insulation sheet a, the positive electrode, the semiconductor laser module, the negative electrode, the insulation sheet b and the upper water drainage block are sequentially arranged from bottom to top. The semiconductor laser module is formed by stacking a plurality of semiconductor laser units, liquid refrigeration sheets of a sheet structure are adopted by the semiconductor laser units, and water drainage areas and chip mounting areas are arranged on the liquid refrigeration sheets. The micro channel refrigeration structure is adopted in the stacked-array liquid refrigeration type high-power semiconductor laser, a plurality of sets of through holes are adopted as refrigeration channels, the structure is simple, compared with a microchannel refrigeration structure, the requirement for the granularity of refrigerant fluid is not high, the risk of corroding the liquid refrigeration channels is low, and the reliability of the semiconductor laser is improved.

Description

technical field [0001] The invention belongs to the field of laser manufacturing, and relates to a liquid-cooled high-power semiconductor laser, in particular to a high-power semiconductor laser in a laminated array macro-channel liquid-cooled mode. Background technique [0002] At present, power electronic devices have been widely used in industry, national defense and other fields, with huge market demand and broad development prospects. As the power of electronic devices increases, the thermal diffusion of the matrix material will cause changes in stress. Due to the deposition of heat, the temperature of the semiconductor laser chip will increase and the output wavelength will change, making the semiconductor laser unable to work normally. In order to improve the power, reliability and performance stability of power electronic devices and reduce production costs, it is necessary to design an efficient heat dissipation structure. Therefore, it is necessary to design and m...

AI Technical Summary

Problems solved by technology

For high-power semiconductor lasers, conduction cooling is used, and the heat dissipation efficiency is low, which will lead to a decrease in device life and reliability, and the increase in output power is limited; if micro-channel liquid cooling is used, due to the large diameter of the cooling channel Small, the cooling liquid needs to use high-quality deionized water, the cost is high, and long-term use will cause corrosion or blockage of the microchannel tube wall, which seriously affects the reliability of the semiconductor laser

[0004] Chinese patent 200910023748.2 proposes a semiconductor laser array structure for macro-channel liquid cooling. Although the tube wall blockage problem of micro-channel liquid cooling is solved, the cooling plate of this structure adopts the structure of heat dissipation fins, and the liquid turbulence is small. The heat dissipation effect needs to be improved, which restricts the further improvement of the power and application fields of semiconductor lasers

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