Non-adhesive technology of gold plating finger OSP process

Abstract

The invention discloses a non-adhesive technology of a gold plating finger OSP process. The non-adhesive technology comprises the following steps: firstly, increasing the purity of nickel bath liquid medicine, and shortening the cleaning maintenance period of the nickel bath liquid medicine so that the cleaning maintenance frequency of the nickel bath liquid medicine is adjusted to be 5-10 days at a time from 30 days at a time; secondly, reducing impurities of the nickel bath liquid medicine, and shortening the Hartz piece test analysis period of flexible and moisture additives in a nickel bath so that the Hartz piece test analysis frequency is adjusted to be 5-10 days at a time from one month at a time; thirdly, eliminating copper ions, taking 3-5 hours as a time period, and conducting cleanup operation on the copper ions adsorbed by nickel sulfide residuals on the surface of an anode nickel film; fourthly, adopting a microetching mode of sulfuric acid matched with hydrogen peroxide by an OSP, and controlling the microetching rate of the OSP to be 30-60 microinches per second. The invention provides the non-adhesive technology of the gold plating finger OSP process.

Description

technical field [0001] The invention relates to the field of PCB board production, in particular to a glue-free process of gold-plated finger OSP process. Background technique [0002] Because the gold layer is too thin, porosity (Pores) or scratches may appear, which may expose the bottom nickel. Therefore, in the case of nickel plating with many impurities in a corrosive environment, gold will appear to play the role of the cathode and force the bottom nickel. Nickel acts as an anode, thus producing a rapid nickel dissolution of the Galvanic Effect type. The two electrons thrown out by the dissolution of nickel metal into nickel ions will cause the copper ions in the solution to be simultaneously reduced and deposited on the gold surface, thus making the color of the gold surface film darker, and even appear metallic copper, which is the so-called gold. Finger exposed copper phenomenon, although the current OSP micro-etching potion is being continuously optimized to minim...

AI Technical Summary

Problems solved by technology

The two electrons thrown out by the dissolution of nickel metal into nickel ions will cause the copper ions in the solution to be reduced and deposited on the gold surface synchronously, thus making the color of the gold surface film darker, and even appear metallic copper, which is the so-called gold. Finger exposed copper phenomenon, although the current OSP micro-etching potion is being continuously optimized to minimize the damage of the Giavani effect on the gold surface, but if the gold-nickel coating itself cannot resist micro-etching, it is equivalent to the best micro-etching potion Also have more than enough heart but not enough strength

As a result, adhesive tape must be used to protect OSP before production, which takes a lot of manpower, materials, and time.