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Insulating layer material, stainless steel based copper clad plate, surface treatment method and preparation method

An insulating layer and stainless steel technology, applied in the field of insulating layer materials, surface treatment methods and preparation, and stainless steel-based copper clad laminates, can solve problems such as delamination cracking and delamination cracking, and achieve low cost, high production efficiency, and thermal conductivity. high effect

Active Publication Date: 2015-05-13
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide an insulating layer material, a stainless steel-based copper-clad laminate, a surface treatment method and a preparation method, aiming at solving the problem of delamination explosion and delamination in the existing high-thermal conductivity stainless steel-based copper-clad laminate. Problems such as cracking

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A high thermal conductivity insulating layer material, by mass parts, includes the following components:

[0049] 120 parts of bisphenol A epoxy resin;

[0050] 1 part of acid anhydride;

[0051] 5 parts of 2-ethylimidazole;

[0052] 40 parts of titanate coupling agent;

[0053] 500 parts of aluminum oxide;

[0054] 1 part of toluene.

Embodiment 2

[0056] A high thermal conductivity insulating layer material, by mass parts, includes the following components:

[0057] 100 parts of glycidyl ether epoxy resin;

[0058] 28 parts of polyamines;

[0059] 3 parts of 1-cyanoethyl-2-ethyl-4-methylimidazole;

[0060] 24 parts of silane coupling agent;

[0061] 120 parts of silicon dioxide;

[0062] 30 parts of cyclohexanone.

Embodiment 3

[0064] A high thermal conductivity insulating layer material, by mass parts, includes the following components:

[0065]80 parts of phosphorus-containing epoxy resin;

[0066] 50 parts of acid anhydride;

[0067] 0.05 parts of 2-ethyl-4-methylimidazole;

[0068] Aluminate coupling agent 1 part;

[0069] 1 part of beryllium oxide;

[0070] 50 parts of methyl butanone.

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Abstract

The invention discloses an insulating layer material, a stainless steel based copper clad plate, a surface treatment method and a preparation method. The insulating layer material with high thermal conductivity comprises components in parts by mass as follows: 80-120 parts of epoxy resin, 1-50 parts of a curing agent, 0.05-5 parts of a curing accelerator, 1-40 parts of an additive, 1-500 parts of hyperpure filler with high thermal conductivity and 1-50 parts of an organic solvent. The prepared stainless steel based copper clad plate with high thermal conductivity has the following advantages: 1, the stainless steel based copper clad plate has high thermal conductivity and is superior to like products in the market; 2, the insulation property is good, the puncture resistant voltage can be up to or higher than 6KV; 3, the insulating layer with high thermal conductivity is combined with the stainless steel base well, and the layered plate blasting phenomenon is avoided during heat shock; 4, the mechanical processing property is good, and the layered cracking phenomenon of a medium layer is avoided; 5, the production efficiency is high; 6, the cost is low and is about one second of commercially available products.

Description

technical field [0001] The invention relates to the technical field of manufacturing metal-based copper-clad laminates, in particular to insulating layer materials, stainless-steel-based copper-clad laminates, surface treatment methods and preparation methods. Background technique [0002] In recent years, with the rapid development of LED lighting, high-power electrical appliances, LED, TV backlight and various power supplies, as well as the recovery after the economic crisis, the market demand for high thermal conductivity metal-based copper clad laminates has risen sharply, and a high thermal conductivity aluminum-based Copper-clad laminates are the main body, and copper-based copper-clad laminates, stainless-steel-based copper-clad laminates and special composite-based copper-clad laminates are the tributaries of the high thermal conductivity metal-based market structure. High thermal conductivity stainless steel-based copper clad laminates are mainly used in environment...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L63/02C08K13/02C08K3/22C08K3/36C08G59/42C08G59/50B41M1/12B41M1/28B32B37/06B32B37/10B32B37/15B32B15/092B32B15/18B32B15/20
Inventor 陈毅龙赖海平严振坤谭小林王远肖尊民
Owner KINWONG ELECTRONICS TECH LONGCHUAN