A method of producing environment-friendly density board and special medium and low temperature curing agent
A curing agent, MDF technology, used in applications, adhesives, household components, etc., can solve problems such as reducing product output and quality, prolonging curing time, etc., to improve service life, avoid equipment aging, and ensure physical and mechanical properties and use. performance effect
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Embodiment 1
[0016] Mix 50kg of ammonium bisulfate, 100kg of ammonium polyphosphate, 2kg of sodium lauryl sulfate, and 848kg of water into a special medium and low temperature curing agent solution.
[0017] In the production of MDF fiberboard, the special medium and low temperature curing agent solution is added in the process of spraying under pressure during the sizing process of wood chip fibers; the wood chip fibers are ordinary alkaline wood chips; The ratio of glue quality is 4-7:100; the applied glue is urea-formaldehyde glue.
[0018] The average temperature of the hot pressing plate is 170-190°C.
Embodiment 2
[0020] Mix 80kg ammonium bisulfate, 100kg ammonium polyphosphate, 2kg sodium lauryl sulfate, and 818kg water to form a special medium and low temperature curing agent solution.
[0021] In the production of MDF fiberboard, the special medium and low temperature curing agent solution is added in the process of sizing the wood chip fiber by pressurized spraying; the wood chip fiber is highly alkaline wood chips; the quality of the special medium and low temperature curing agent solution is related to the sizing process. The mass ratio is 5-9:100; the applied glue is urea-formaldehyde glue.
[0022] The outlet temperature of the heat transfer oil of the heat press is controlled at 205 degrees.
Embodiment 3
[0024] Mix 120kg of ammonium bisulfate, 100kg of ammonium polyphosphate, 2kg of sodium lauryl sulfate, and 778kg of water into a special medium and low temperature curing agent solution.
[0025] In the production of MDF fiberboard, it is used for the production of E1 grade boards. The special medium and low temperature curing agent solution is added in the process of spraying under pressure during the sizing process of wood chip fibers; the quality of the special medium and low temperature curing agent solution and the quality of sizing The ratio is 5-11:100; the glue applied is urea-formaldehyde glue.
[0026] The outlet temperature of the heat transfer oil of the heat press is controlled at 205 degrees.
[0027] Compared with the ammonium chloride curing agent of the background technology, the special medium and low temperature curing agent of the present invention has a simple production effect, and can maintain the physical and mechanical properties and use performance of...
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