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Fluorine-containing polyimide composite film material with low infrared emissivity and preparation method thereof

A technology of fluorine-containing polyimide and polyimide film, applied in the field of fluorine-containing polyimide infrared low emissivity composite film material and its preparation, can solve the problems of low emissivity and inability to implement infrared stealth , to achieve the effect of excellent film-forming performance, excellent compatibility and low cost

Inactive Publication Date: 2015-05-20
NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this material can have a certain effect on the infrared stealth of static passive targets, it cannot implement effective infrared stealth for high-temperature targets and targets with heat sources, such as aircraft engine nozzles, ships, and tank engines. The design and preparation of low-emissivity materials has always been the difficulty of infrared stealth. At present, low emissivity cannot be achieved at a very low level.

Method used

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  • Fluorine-containing polyimide composite film material with low infrared emissivity and preparation method thereof
  • Fluorine-containing polyimide composite film material with low infrared emissivity and preparation method thereof
  • Fluorine-containing polyimide composite film material with low infrared emissivity and preparation method thereof

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Embodiment 1

[0051] In this embodiment, the infrared low-emission composite film is composed of a fluorine-containing polyimide film and ITO, wherein the structural formula of the fluorine-containing polyimide is exactly the same as that of the fluorine-containing polyimide film in Comparative Example 1, That is:

[0052]

[0053] ITO is dispersed in fluorine-containing polyimide film-forming resin as crystal phase powder to form a multi-phase solid film; the mass ratio of fluorine-containing polyimide to ITO is 9.5:0.5.

[0054] The preparation method of above-mentioned composite film is as follows:

[0055] (1) Utilizing the preparation method in Comparative Example 1 to prepare a fluorine-containing polyimide film;

[0056] (2) Take 8g of fluorine-containing polyimide film and dissolve it in 150mL of DMAc organic solvent, add ITO to the obtained clear liquid, in which the mass ratio of fluorine-containing polyimide to ITO is 9.5:0.5, and ultrasonically vibrate for 20 minutes to make...

Embodiment 2

[0059] In this embodiment, the infrared low-emission composite film is composed of a fluorine-containing polyimide film and ITO, wherein the structural formula of the fluorine-containing polyimide film is exactly the same as that of the fluorine-containing polyimide film in Example 1. ITO is dispersed in fluorine-containing polyimide film-forming resin as crystal phase powder to form a multi-phase solid film; the mass ratio of fluorine-containing polyimide to ITO is 9:1.

[0060] The preparation method of above-mentioned composite film is as follows:

[0061] (1) Using the preparation method in Example 1 to prepare a fluorine-containing polyimide film;

[0062] (2) Take 8 g of fluorine-containing polyimide film and dissolve it in 150 mL of DMAc organic solvent, add ITO to the obtained clear solution, wherein the mass ratio of fluorine-containing polyimide to ITO is 9:1, and ultrasonically vibrate for 20 minutes to make a suspension turbid solution; then, cast the suspension o...

Embodiment 3

[0065] In this embodiment, the infrared low-emission composite film is composed of a fluorine-containing polyimide film and ITO, wherein the structural formula of the fluorine-containing polyimide is exactly the same as that of the fluorine-containing polyimide film in Example 1, and the ITO The crystal phase powder is dispersed in the fluorine-containing polyimide film-forming resin to form a multi-phase solid film; the mass ratio of fluorine-containing polyimide to ITO is 9.9:0.1.

[0066] The preparation method of above-mentioned composite film is as follows:

[0067] (1) Using the preparation method in Example 1 to prepare a fluorine-containing polyimide film;

[0068] (2) Dissolve 8g of fluorine-containing polyimide in 150mL of DMAc organic solvent, add ITO to the obtained clear liquid, in which the mass ratio of fluorine-containing polyimide to ITO is 9.9:0.1, and oscillate ultrasonically for 20 minutes to make a suspension liquid; then, cast the suspension on a glass p...

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Abstract

The invention provides a fluorine-containing polyimide composite film material with a low infrared emissivity and a preparation method thereof. The composite material is prepared by adding 1 to 10% of nano inorganic substances into a fluorine-containing polyimide material, and the nano inorganic substances are actually crystal particles dispersed in the fluorine-containing polyimide. The experiment results show that the thermal stability, environment resistant performance, and low infrared emissivity property of the composite material containing the inorganic substances are all improved, especially the infrared emissivity is greatly reduced, so the provided material can be used to prepare infrared stealth materials having a high requirement on stability and has a good application prospect in the military and civilian fields.

Description

technical field [0001] The invention relates to the technical field of infrared stealth and camouflage, in particular to a fluorine-containing polyimide infrared low emissivity composite film material and a preparation method thereof. Background technique [0002] The traditional infrared stealth and camouflage technology mainly uses low-emissivity materials to segment and deform the target's outline to achieve the purpose of stealth. Although this material can have a certain effect on the infrared stealth of static passive targets, it cannot implement effective infrared stealth for high-temperature targets and targets with heat sources, such as aircraft engine nozzles, ships, and tank engines. The design and manufacture of low-emissivity materials has always been a difficult point for infrared stealth, and currently low-emissivity cannot be achieved at a very low level. Therefore, the core of reducing infrared emissivity is to find low infrared emissivity materials with ex...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K3/22C08K3/36C08K7/00C08K3/04C08K3/34C08K3/30C08J5/18C08G73/10
CPCC08K3/22C08G73/1071C08J5/18C08J2379/08C08K3/30C08K3/346C08K3/36C08K7/24C08K2003/2231C08K2003/2241C08K2003/2244C08K2003/2296C08K2003/3009C08K2201/011C08L2201/08C08L2203/16C08L79/08
Inventor 陈景刘秉鑫陈修碧薛立新
Owner NINGBO INST OF MATERIALS TECH & ENG CHINESE ACADEMY OF SCI
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