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A kind of preparation method of the epoxy resin conductive glue that is used for LED chip bonding

An LED chip and epoxy resin technology, applied in the field of conductive adhesive, can solve the problems of easy falling off and low adhesion of workpieces, and achieve the effects of improving thermal conductivity, shear strength and electrical conductivity.

Inactive Publication Date: 2016-09-07
SPIMAGE XIAMEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this conductive adhesive uses graphene to modify the silver powder, its adhesion to the workpiece is not high during use, and it is prone to fall off after long-term use.

Method used

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  • A kind of preparation method of the epoxy resin conductive glue that is used for LED chip bonding

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preparation example Construction

[0029] The preparation method of the above-mentioned components can be uniformly mixed according to common methods, and then ground.

[0030] After the conductive adhesive is applied on the working surface, it can be cured by heating or curing at room temperature. It is preferably cured under the condition of heating to 80-90° C. for 4-6 hours.

Embodiment 1

[0032] Add 10g of monomer 3-methylcatechol, 4g of hydroxymalonic acid, 12g of m-trifluoromethylphenol and 15g of 4,4'-dihydroxybiphenyl into 90g of epichlorohydrin, mix well, and then add 30wt% NaOH aqueous solution, wherein the molar amount of NaOH is 0.8 times of the total hydroxyl groups in the four monomers, connect the condenser to reflux, stir and react at 60°C for 1 hour, then raise the temperature to 90°C, and react for 2 hours After finishing the reaction, evaporate the solvent to dryness, then dissolve the residue in methyl isobutyl ketone, wash with water, remove the water phase, and evaporate the solvent to dryness in the organic phase to obtain a modified epoxy resin.

[0033] The modified epoxy resin obtained is mixed with bisphenol A type epoxy resin 45g, poly-1,3-trimethylene glycol ester 10g (crystalline polyester resin), ethylene glycol glycidyl ether 12g (epoxy resin) Resin diluent), micron spherical silver powder 400g, tert-butylpyrogallol 4g (curing agent)...

Embodiment 2

[0035] Add 20g of monomer 3-methylcatechol, 6g of hydroxymalonic acid, 16g of m-trifluoromethylphenol and 30g of 4,4'-dihydroxybiphenyl into 140g of epichlorohydrin, mix well, and then add 30wt% NaOH aqueous solution, wherein the molar weight of NaOH is 1.2 times of the total hydroxyl groups in the four monomers, connect the condenser to reflux, stir and react at 60°C for 3 hours, then heat up to 90°C, and react for 4 hours After finishing the reaction, evaporate the solvent to dryness, then dissolve the residue in methyl isobutyl ketone, wash with water, remove the water phase, and evaporate the solvent to dryness in the organic phase to obtain a modified epoxy resin.

[0036] The modified epoxy resin obtained is mixed with bisphenol A type epoxy resin 60g, poly-1,3-trimethylene glycol ester 12g (crystalline polyester resin), ethylene glycol glycidyl ether 15g (epoxy resin) Resin diluent), micron spherical silver powder 700g, tert-butylpyrogallol 9g (curing agent), 2-ethyl 4-...

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Abstract

The invention relates to a preparation method of an epoxy resin conductive adhesive for bonding an LED chip and belongs to the technical field of conductive adhesives. The preparation method comprises the following steps: uniformly mixing the following components in parts by weight: 45-60 parts of modified epoxy resin and bisphenol A epoxy resin, 10-12 parts of crystallized polyester resin, 12-15 parts of an epoxy resin diluent, 400-700 parts of silver powder, 4-9 parts of a curing agent, 4-6 parts of a curing accelerant, 4-15 parts of an organic solvent and 3-5 parts of an antioxidant; and grinding the components, wherein the modified epoxy resin is prepared by carrying out epoxidation reaction on a mixture of 3-methylcatechol, tartronic acid, m-trifluoromethylphenol and 4, 4'-dihydroxybiphenyl and epichlorohydrin. By modifying the epoxy resin, the conductivity of the conductive adhesive prepared is improved, and moreover, the heat conducting strength and the shearing strength are improved.

Description

technical field [0001] The invention relates to a preparation method of epoxy resin conductive adhesive used for bonding LED chips, and belongs to the technical field of conductive adhesive. Background technique [0002] With the rapid development of the semiconductor integrated circuit packaging industry, it has occupied the dominant position in the domestic integrated circuit industry, and how to choose electronic packaging materials is more important. According to data, most integrated circuits use chip bonding materials, and epoxy resin conductive adhesive (silver adhesive for short) is the most common adhesive material. [0003] General epoxy adhesives are insulating, and conductive fillers such as silver powder, copper powder, and carbon black are added to have certain conductivity and good bonding performance after curing, so that an electrical bond is formed between the bonded materials. Pathway, that is, epoxy conductive adhesive. It is a functional adhesive with ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/08C09J11/06
Inventor 潘小和
Owner SPIMAGE XIAMEN CO LTD
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