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Method for making insulating substrate for electronic device

A technology of electronic components and insulating substrates, which is applied in the field of insulating substrates, can solve the problems of poor durability, high quality, and high manufacturing cost of circuit boards, and achieve the effect of increasing insulation performance and simple process

Inactive Publication Date: 2015-05-20
WUXI NUIST WEATHER SENSOR NETWORK TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The production of the insulating substrate directly affects the insulation performance of the board. In the existing production process, the complex production process results in high production cost, but the overall basic quality is high.
Most of the manufacturers use a simpler single-coating method. Such circuit boards are cheap but poor in durability and not very stable in quality.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] A method for manufacturing an insulating substrate for electronic components, the manufacturing steps are as follows:

[0033] 1) Prepare the wiring substrate, and cut the substrate to a suitable size;

[0034] 2) The first layer of insulating material is sealed on the wiring substrate after the groove is completed; the thickness of the first layer of insulating material is 15um. The first layer of insulation is made of polyimide.

[0035] 3) After the first layer of insulating material is sealed and coated, it is dried;

[0036] 4) After completing the drying step, seal the second layer of insulating material; the second layer of insulating material is 18um. The second layer of insulation is made of polyether nitrile.

[0037] 5) After the second layer of insulating material is completed, it is completed after the inspection of the substrate.

Embodiment 2

[0039] A method for manufacturing an insulating substrate for electronic components, the manufacturing steps are as follows:

[0040] 1) Prepare the wiring substrate, and cut the substrate to a suitable size;

[0041] 2) The first layer of insulating material is sealed on the wiring substrate after the groove is completed; the thickness of the first layer of insulating material is 17um. The first layer of insulation is made of acrylic.

[0042] 3) After the first layer of insulating material is sealed and coated, it is dried;

[0043] 4) After completing the drying step, seal the second layer of insulating material; the second layer of insulating material is 19um. The second layer of insulation is made of polyvinyl chloride.

[0044] 5) After the second layer of insulating material is completed, it is completed after the inspection of the substrate.

[0045] Insulation materials are also selected from the following materials:

[0046] Epoxy resin: Epoxy resin is origina...

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PUM

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Abstract

The invention relates to a method for making an insulating substrate for an electronic device and belongs to the field of electronic devices. The method includes the following steps: preparing a wiring substrate, and cutting the wiring substrate to be in proper size; sealing and coating a first-layer insulating material on the wiring substrate after grooving is completed; after sealing and coating of the first-layer insulating layer is completed, drying; sealing and coating a second-layer insulating material after drying is completed; after sealing and coating of the second-layer insulating material is completed, detecting the wiring substrate to obtain the insulating substrate. In the method, a two-layer spraying mode is adopted, so that insulating performance of the insulating substrate is improved greatly. The method is simple and suitable for processing of most insulating substrates.

Description

technical field [0001] The invention relates to a method for manufacturing an insulating substrate for electronic components, belonging to the field of electronic components. Background technique [0002] Electrical insulation materials are mainly used in motors and electrical appliances, such as the insulation of armature slot wedges, stator windings, and rotor windings in generators and motors. Insulating varnishes, resin fluids and adhesives. For example, insulating dipping varnish, silicon steel sheet varnish, enameled wire varnish, potting resin liquid and various adhesives are commonly used epoxy resin, polyester, polyurethane, silicone resin, polyimide alkyd resin (see alkyd resin coating )Wait. Impregnated fiber products. Such as insulating cloth, tape and other products obtained by impregnating various types of cotton, silk, synthetic fiber and glass fiber or fabric with resin. Laminated products. Laminate products made of various organic or inorganic substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH01L21/481
Inventor 禹胜林
Owner WUXI NUIST WEATHER SENSOR NETWORK TECH