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Heat pump units, air conditioners and refrigerators

A heat pump device and motor technology, applied in refrigerators, refrigeration components, refrigeration and liquefaction, etc., can solve problems such as the inability to use sensorless vector control, and achieve the effect of suppressing cost increase

Active Publication Date: 2018-05-25
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, sensorless vector control cannot be used during start-up where the current through the motor cannot be utilized

Method used

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  • Heat pump units, air conditioners and refrigerators
  • Heat pump units, air conditioners and refrigerators
  • Heat pump units, air conditioners and refrigerators

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0029] In this embodiment, refer to Figure 1 to Figure 6 The structure and operation of the heat pump device of the present invention will be described.

[0030] figure 1 It is a figure which shows the heat pump apparatus 10 which is one structural example of the heat pump apparatus of this embodiment. figure 1 The illustrated heat pump device 10 includes a refrigeration cycle unit 11 , an inverter unit 12 , and an inverter control unit 13 . The heat pump device 10 is applied to, for example, an air conditioner or a refrigerator.

[0031] The refrigeration cycle unit 11 includes a compressor 14 , a four-way valve 15 , a heat exchanger 16 , an expansion mechanism 17 , and a heat exchanger 18 , and these are connected by a refrigerant pipe 19 .

[0032] The compressor 14 includes a compression mechanism 20 and a motor 21 inside. The compression mechanism 20 compresses the refrigerant. The motor 21 is a three-phase motor having three-phase windings of U-phase, V-phase, and ...

Embodiment approach 2

[0062] The heat pump device of the present invention was described in Embodiment 1, and in this embodiment, refer to Figure 7 with Figure 8 The current sensor (current sensor 26a and current sensor 26b in Embodiment 1) included in the heat pump device of the present invention will be described.

[0063] Figure 7 It is a diagram showing a configuration example of the current sensor 26a and the current sensor 26b when a low-resistance resistance element (for example, 10Ω) is used for the ACCT secondary-side (output-side) resistor 43 included in the heat pump device 10 .

[0064] The output voltage is low when the resistance value of the secondary side resistor 43 of ACCT is low. Thus, in Figure 7 In the shown configuration example, an amplifier 44 is provided at the secondary-side output post-stage to amplify a voltage that can be input to a microcomputer 45 . However, in Figure 7 In the configuration example shown, the cost increases due to the amplifier 44, and the o...

Embodiment approach 3

[0075] In this embodiment, a preferred form of the heat pump device 10 of the present invention will be described. In this embodiment, the switching elements 27a to 27f ( figure 2 ) using a wide bandgap semiconductor.

[0076] By using a wide bandgap semiconductor for the switching elements 27a to 27f, the element loss of the switching elements 27a to 27f can be reduced and the current can be increased. Therefore, compared with the case where the wide bandgap semiconductor is not used, the heat sink can be miniaturized or eliminated.

[0077] In addition, examples of wide bandgap semiconductors that can be used in this embodiment include silicon carbide (silicon carbide, also referred to as SiC), diamond, and gallium nitride-based materials (materials containing gallium nitride as a main component).

[0078] Figure 9 It is a graph showing the relationship between the withstand voltage and on-resistance of a silicon element (Si element) and a silicon carbide element (SiC e...

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Abstract

A heat pump that has a compressor equipped with a motor for which sensorless vector control is possible even at a low rotation speed or under a low load is obtained while the cost thereof is suppressed. This heat pump device is equipped with a refrigerant compressor (14) that is driven by a motor (21), an inverter unit (12) for applying a voltage to the motor (21), current sensors (26a, 26b) for detecting a motor current, and an inverter control unit (13) for outputting a drive signal to the inverter unit (12). The inverter control unit (13) is equipped with a voltage command computation part (25) and a drive signal generation section (23). The drive signal generation section (23) is equipped with an amplitude / phase determination part (33) that determines a refrigerant compression amount required of the compressor (14) in accordance with signals from the current sensors (26a, 26b) so as to determine an amplitude and a phase in order for the drive signal generation section (23) to generate a drive signal. When the motor (21) is operating at a low rotation speed or under a low load, the voltage command computation part (25) corrects the signals from the current sensors (26a, 26b) in accordance with the rotation speed or the load.

Description

technical field [0001] The present invention relates to a heat pump device, an air conditioner, and a refrigerator using a compressor. Background technique [0002] In a compressor of a conventional heat pump device, vector control is generally employed when sensorlessly controlling the magnetic pole position of a permanent magnet synchronous motor included in the compressor. In the vector control, the current of the motor is separated into a d-axis component and a q-axis component, and an optimal current value corresponding to the rotor position is calculated, thereby enabling efficient control with less torque variation. [0003] In order to perform such vector control, it is necessary to grasp the magnetic pole position of the rotor. In the high-speed sensorless vector control that does not use a magnetic pole position sensor, the magnetic pole position is estimated based on the value of the current (motor current) flowing through the motor. That is, the motor current i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02P27/02H02P21/00H02P23/00H02P27/04
CPCF25B13/00F25B49/022F25B2600/021F25B2700/151H02P21/04H02P21/18Y02B30/70
Inventor 神谷庄太畠山和德天野胜之伊藤典和富田雅史
Owner MITSUBISHI ELECTRIC CORP
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