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Cationic curing epoxy organic silicon resin and preparation method thereof

An epoxy silicone, cationic curing technology, applied in the field of polymer chemistry, can solve the problems of poor product performance, small number of epoxy groups, difficult to control the proportion, etc., and achieve short preparation route, high cross-linking density, The effect of easy operation

Inactive Publication Date: 2015-06-03
SHANGHAI INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Aiming at the above-mentioned technical problems in the prior art, the present invention provides a cationic curing epoxy silicone resin and a preparation method thereof, the cationic curing epoxy silicone resin and its preparation method solve the The preparation method has technical problems such as poor product performance due to difficult control of the proportioning ratio and the small number of epoxy groups in the epoxy silicone molecule.

Method used

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  • Cationic curing epoxy organic silicon resin and preparation method thereof
  • Cationic curing epoxy organic silicon resin and preparation method thereof
  • Cationic curing epoxy organic silicon resin and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0028] A preparation method of cationic curing epoxy silicone resin specifically includes the following steps:

[0029] (1) Preparation of cyclotetrasiloxane containing epoxy group

[0030] Proportionally add 100 parts by weight of 1,3,5,7-tetramethylcyclotetrasiloxane and 190 parts by weight of allyl glycidyl ether into a 1000ml four mouthpiece equipped with a stirrer, condenser, constant pressure funnel and thermometer Into the flask, add 100 parts by weight of toluene, 0.001 parts by weight of chloroplatinic acid-isopropanol solution, and at the same time add 0.001 parts by weight of 4-methoxyphenol; then the temperature was raised to 80°C and reacted for 4h. The reaction mixture was kept at 150°C in Distill under reduced pressure at 0.096MPa to remove the solvent and residual low boilers to obtain a colorless liquid with a viscosity of 3000 mPa.s, namely cyclotetrasiloxane containing epoxy groups.

[0031] The cyclotetrasiloxane containing epoxy groups obtained above was analyze...

Embodiment 2

[0041] (1) Preparation of cyclotetrasiloxane containing epoxy group

[0042] Proportionally add 100 parts by weight of 1,3,5,7-tetramethylcyclotetrasiloxane and 195 parts by weight of allyl glycidyl ether into a 1000ml four-mouth equipped with a stirrer, condenser, constant pressure funnel and thermometer Into the flask, add 150 parts by weight of cyclohexane, 0.003 parts by weight of chloroplatinic acid, and add 0.003 of hydroquinone at the same time; then heated to 90°C, reacted for 2h, and the reaction mixture was distilled under reduced pressure at 160°C under -0.096MPa , Remove the solvent and residual low boilers to obtain a light yellow liquid with a viscosity of 4300mPa.s, that is, cyclotetrasiloxane containing epoxy groups.

[0043] According to the determination of the national standard GB / T 1677-2008 plasticizer epoxy value, the epoxy value of the cyclotetrasiloxane containing epoxy group obtained above is determined to be 0.61, which is close to the theoretical value of...

Embodiment 3

[0051] (1) Preparation of cyclotetrasiloxane containing epoxy group

[0052] Add 100 parts by weight of 1,3,5,7-tetramethylcyclotetrasiloxane and 200 parts by weight of allyl glycidyl ether into a 1000ml four-necked flask equipped with a stirrer, condenser, constant pressure funnel and thermometer , Add 200 parts by weight of cyclohexane, 0.003 parts by weight of chloroplatinic acid, and add 0.003 hydroquinone at the same time; then increase the temperature to 90°C and react for 2h. The reaction mixture is distilled under reduced pressure at 160°C under -0.096MPa to remove Solvent and residual low-boiling matter to obtain a light yellow liquid with a viscosity of 4300mPa.s, namely cyclotetrasiloxane containing epoxy groups.

[0053] According to the determination of the national standard GB / T 1677-2008 plasticizer epoxy value, the epoxy value of the cyclotetrasiloxane containing epoxy group obtained above is determined to be 0.61, which is close to the theoretical value of 0.63.

[...

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Abstract

The invention provides a cationic curing epoxy organic silicon resin of which the structural formula is disclosed in the specification. The invention also provides a preparation method of the resin, which comprises the following steps: adding 1,3,5,7-tetramethylcyclotetrasiloxane and allyl glycidyl ether into a reaction vessel, and adding a solvent, a catalyst and a polymerization inhibitor; heating to react, distilling the reaction mixture under reduced pressure to obtain epoxy-group-containing cyclotetrasiloxane, adding the epoxy-group-containing cyclotetrasiloxane, methylphenylcyclosiloxane and a blocking agent into another reaction vessel, heating to react in a nitrogen protective atmosphere, and distilling under reduced pressure, thereby obtaining the cationic curing epoxy organic silicon resin. The curing product of the cationic curing epoxy organic silicon resin has the characteristics of high crosslinking degree, high hardness and the like.

Description

Technical field [0001] The invention belongs to the field of polymer chemistry, and in particular relates to an epoxy silicone resin, specifically a cationic curing epoxy silicone resin and a preparation method thereof. Background technique [0002] Light-curing organic silicon materials are favored because of their excellent properties of organic silicon materials and the characteristics of high-efficiency and energy-saving light-curing technology, and are gradually being widely used. According to different curing mechanisms, light-curing silicone systems are generally divided into two categories: free radical light-curing systems and cationic light-curing systems. Free radical silicone light curing system has the disadvantages of large volume shrinkage and oxygen inhibition, while cationic silicone light curing system has the advantages of not being interfered by oxygen inhibition, good thick film curing, small volume shrinkage, strong adhesion, wear resistance, The advantages...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/32C07F7/21
Inventor 张英强赵永新徐耀民
Owner SHANGHAI INST OF TECH
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