Fabrication method of silicon-based ultraviolet enhanced photodiode
A technology of photodiodes and manufacturing methods, which is applied in the direction of circuits, electrical components, semiconductor devices, etc., can solve the problems of high purchase price and dependence on foreign imports, and achieve the effect of low cost and simple process
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0027] A method for manufacturing a silicon-based ultraviolet enhanced photodiode, the innovation of which is that the steps of the method are:
[0028] 1) N-type silicon epitaxial material is used as the substrate, including the substrate layer 4 and the epitaxial layer 1, wherein the resistivity of the substrate layer 4 is less than 0.001Ω·cm; the resistivity of the epitaxial layer 1 is 20Ω·cm~500Ω·cm, the thickness 20 μm to 100 μm; the device end face on the side where the epitaxial layer 1 is located is marked as the front side, and the device end face on the side where the substrate layer 4 is located is marked as the back side;
[0029] 2) using a high temperature oxidation process to form a silicon dioxide passivation layer 5 on the surface of the device;
[0030] 3) Photolithography is used to photoetch the guard ring doped area on the front of the device, and a wet etching process is used to etch the oxide layer within the range of the guard ring doped area;
[0031]...
PUM
| Property | Measurement | Unit |
|---|---|---|
| electrical resistivity | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
| thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 