A Grinding Method for Controlling Grinding Parameters

Abstract

The invention discloses a grinding method for controlling grinding parameters, which comprises the following steps: placing a temperature measuring sample and a workpiece to be processed in an insulating fixture close to each other; exploring the grinding process, and summarizing the grinding process in the grinding process. The change law of cutting temperature; when grinding the workpiece to be processed, the grinding temperature is constantly monitored through the control system. The invention adopts the measuring sample of the same material as the workpiece and processes the parts to be processed at the same time, and embeds a thermocouple in the measuring sample instead of the actual part to measure the grinding temperature, and realizes online temperature feedback without destroying the processed parts and real-time control of grinding parameters. The present invention adopts the clamped wire thermocouple, the temperature acquisition system and the control system to monitor and feed back the grinding temperature in real time, which can improve the quality consistency of grinding parts in batches, and can make full use of the grinding performance of the grinding wheel at different stages to improve the utilization rate. rate, cost savings. The invention can be measured many times, used repeatedly, easy to manufacture and high in accuracy.

Description

technical field [0001] The invention relates to a grinding method for controlling grinding parameters, which belongs to the field of high-efficiency and high-quality grinding. Background technique [0002] In recent years, the quality consistency requirements for batch parts have become more and more stringent. The so-called product quality consistency means that the products produced in the workshop are consistent in production, and there is no fluctuation in product quality (neither preference nor deviation). In the batch processing of high-precision parts, grinding is usually the last process to ensure the accuracy and quality of the product. At present, the widely used method is to first dress the grinding wheel, and then grind the same batch of parts with fixed parameters after dressing, that is, constant feed grinding, and the processing parameters will not be adjusted or changed during the entire grinding process. However, in the batch continuous grinding process, t...

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Problems solved by technology

Chinese patent CN102398220A discloses "Grinding Area Temperature Measuring Device for Surface Grinding" and Chinese Patent CN202066612U discloses "A Grindable Semi-Artificial Thermocouple Measuring Grinding Surface Temperature Device", etc., which are directly measured by semi-artificial thermocouple method The temperature of the grinding area can provide a detection method for studying the grinding temperature under different grinding parameters and different grinding wheel states, but it does not involve the temperature feedback during the grinding process and the online control method of grinding parameters

This method needs a built-in thermocouple temperature sensor to measure the grinding temperature, which will damage the processed workpiece, so it cannot be directly used to measure the grinding temperature in the production process. After the grinding process is determined, constant parameter grinding is still used, which cannot solve the problem. The problem of poor processing quality consistency caused by grinding wheel wear and clogging

[0004] Chinese patent CN102009387A discloses "a kind of semiconductor wafer grinding force on-line measuring device and control force grinding method" and Chinese patent CN101716747A discloses "piezoelectric grinding force measuring device for silicon wafer ultra-precision grinding machine", etc., aiming at For the ultra-precision grinding of semiconductor wafers, the piezoelectric sensor is used to measure the grinding force online, and the grinding parameters are controlled through the grinding force feedback to realize controlled force grinding, which is suitable for the grinding of hard and brittle materials sensitive to grinding force The grinding process cannot realize the detection and control of the grinding temperature, and it is powerless to control the grinding process of parts such as superalloys and titanium alloys that are sensitive to grinding temperature and surface burns.

[0005] At present, there is no method for online control of grinding parameters through real-time monitoring and feedback of grinding temperature

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