Radiating device of electronic element

Abstract

The invention provides a radiating device of an electronic element. The radiating device of the electronic element adopts a sealed type active circular heating; a sealing structure is formed through an upper substrate and a microgroove group heat sink; the inner structure of the microgroove group heat sink is that a middle flow way is encircled by two side flow ways, and two side flow ways are interconnected to the bottom part of the middle flow way, and microgroove groups are respectively arranged on the two side flow ways and the middle flow way; upper and lower faces of a lower substrate are respectively bonded with the bottom face of the microgroove group and an electronic element; a cross groove path of the microgroove group heat sink makes the pressure and flowing distributions of cooling mediums more uniform; the downwards impact jet flow makes the heat exchanging efficiency higher.

Description

technical field [0001] The invention belongs to the field of heat dissipation devices, in particular to a heat dissipation device for electronic components. Background technique [0002] Light Emitting Diode (LED) is a new competitive solid light source in the 21st century. Compared with traditional light sources, it has the advantages of long service life, small size, low energy consumption, high reliability, fast response, flexible design, and flexible control. Under the background of "energy saving, environmental protection, and low-carbon economy", LED, as the "fourth generation" lighting source, conforms to the trend of the times and is being widely used in many fields. However, a key factor that restricts the continued promotion of LED light sources is the junction temperature of LED chips. At present, the drive current of power LEDs is as high as 1A, which will cause heat accumulation inside the chip, resulting in a series of problems such as drift of the main wavel...

AI Technical Summary

Problems solved by technology

At present, the drive current of power LEDs is as high as 1A, which will cause heat accumulation inside the chip, resulting in a series of problems such as drift of the main wavelength of light emission, decrease in light extraction efficiency, accelerated aging of phosphor powder, and shortened service life. Natural convection in the existing technology Heat dissipation cannot effectively solve the problem of high junction temperature of heating elements

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