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High-temperature-resistant pressure-sensitive adhesive tape and heat-resistant pressure-sensitive adhesive used by same

A pressure-sensitive adhesive and pressure-sensitive tape technology, applied in the direction of adhesives, film/sheet adhesives, non-polymer adhesive additives, etc., to increase cohesion, reduce surface compression deformation, and improve heat resistance.

Active Publication Date: 2015-07-15
苏州市新广益电子股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, there are few high-performance high-temperature-resistant adhesive tapes that can simultaneously possess high peel strength, high holding force, high adhesive force and wide service temperature

Method used

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  • High-temperature-resistant pressure-sensitive adhesive tape and heat-resistant pressure-sensitive adhesive used by same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Embodiment 1: a high temperature resistant pressure sensitive adhesive tape and the heat resistant pressure sensitive adhesive used therefor;

[0060] A heat-resistant pressure-sensitive adhesive, the raw material formula of the heat-resistant pressure-sensitive adhesive includes the following materials by weight:

[0061] 2-acetamidoacrylic acid 50g;

[0062] Ethylene glycol dimethacrylate 40g;

[0063] Octadecyl acrylate 15g;

[0064] Phenyltrimethoxysilane 3g;

[0065] Vinyltriethoxysilane 5g;

[0066] γ-(2,3-Glycidoxy)propyltrimethoxysilane 4g;

[0067] Nano silica 4g;

[0068] Aluminum hexafluoro-2,4-pentanedione 2g;

[0069] Polyethylene glycol 3g;

[0070] Emulsifier 2g;

[0071] Initiator 1g;

[0072] 300g deionized water;

[0073] The preparation method of heat-resistant pressure-sensitive adhesive comprises the following specific steps:

[0074] (1) Pre-emulsion preparation

[0075] According to the raw material formula, 2-acetamidoacrylic acid, et...

Embodiment 2

[0079] Embodiment 2: A high temperature resistant pressure sensitive adhesive tape and the heat resistant pressure sensitive adhesive used therefor;

[0080] A heat-resistant pressure-sensitive adhesive, the raw material formula of the heat-resistant pressure-sensitive adhesive includes the following materials by weight:

[0081] 2-acetamidoacrylic acid 70g;

[0082] Ethylene glycol dimethacrylate 30g;

[0083] Octadecyl acrylate 12g;

[0084] Phenyltrimethoxysilane 5g;

[0085] Vinyltriethoxysilane 5g;

[0086] γ-(2,3-Glycidoxy)propyltrimethoxysilane 6g;

[0087] Nano silica 5g;

[0088] Aluminum hexafluoro-2,4-pentanedione 2g;

[0089] Polyethylene glycol 5g;

[0090] Emulsifier 3g;

[0091] Initiator 2g;

[0092] 350g deionized water;

[0093] The preparation method of heat-resistant pressure-sensitive adhesive comprises the following specific steps:

[0094] (1) Pre-emulsion preparation

[0095] According to the raw material formula, 2-acetamidoacrylic acid, et...

Embodiment 3

[0099] Embodiment 3: A kind of heat-resistant pressure-sensitive tape and the heat-resistant pressure-sensitive adhesive used therefor;

[0100] A heat-resistant pressure-sensitive adhesive, the raw material formula of the heat-resistant pressure-sensitive adhesive includes the following materials by weight:

[0101] 2-acetamidoacrylic acid 50g;

[0102] Ethylene glycol dimethacrylate 50g;

[0103]Octadecyl acrylate 20g;

[0104] Phenyltrimethoxysilane 4g;

[0105] Vinyltriethoxysilane 4g;

[0106] γ-(2,3-Glycidoxy)propyltrimethoxysilane 3g;

[0107] Nano silica 6g;

[0108] Aluminum hexafluoro-2,4-pentanedione 3g;

[0109] Polyethylene glycol 2g;

[0110] Emulsifier 2g;

[0111] Initiator 0.8g;

[0112] 250g deionized water;

[0113] The preparation method of heat-resistant pressure-sensitive adhesive comprises the following specific steps:

[0114] (1) Pre-emulsion preparation

[0115] According to the raw material formula, 2-acetamidoacrylic acid, ethylene glyco...

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Abstract

The invention relates to a high-temperature-resistant pressure-sensitive adhesive tape and a heat-resistant pressure-sensitive adhesive used by the same. The high-temperature-resistant pressure-sensitive adhesive tape comprises a substrate layer, a heat-resistant primer layer and a heat-resistant adhesive layer which are sequentially laminated. The heat-resistant pressure-sensitive adhesive comprises 40-80 parts of 2-acetaminoacrylic acid, 30-50 parts of ethylene glycol dimethacrylate, 10-20 parts of octadecyl acrylate, 2-10 parts of phenyltrimethoxy silane, 2-10 parts of vinyltriethoxysilane, 2-8 parts of gamma-(2,3-epoxy-propoxy)propyltrimethoxy silane, 1-6 parts of nano silicon dioxide, 1-3 parts of hexafluoro-2,4-acetyldione aluminum, 2-6 parts of polyethyleneglycol, 2-5 parts of emulsifier, 0.5-2 parts of initiator and 200-400 parts of deionized water. The prepared heat-resistant pressure-sensitive adhesive tape can work at 70-160 DEG C, can resist the high temperature of greater than 600 DEG C within a short time, and has the advantages of small surface compression deformation, wear resistance, impact resistance, heat resistance and abrasion resistance.

Description

technical field [0001] The invention relates to a heat-resistant pressure-sensitive adhesive tape and a heat-resistant pressure-sensitive adhesive used therein, belonging to the technical field of adhesive tapes. Background technique [0002] With the rapid development of the economy, adhesive tape has been fully integrated into all walks of life and people's daily life. A special type of tape made by applying a special adhesive (pressure-sensitive adhesive) to a strip-shaped substrate. Pressure-sensitive adhesive is the most important component of pressure-sensitive tape, its function is to make the tape have pressure-sensitive adhesive properties. Under the action of small pressure, the pressure-sensitive adhesive can form a firm adhesive force. The adhesive force formed between the surfaces of two objects is mainly van der Waals force. Therefore, after the adhesive surface is formed, the structure of the adhesive surface is not the same. Not destroyed. Because pressure...

Claims

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Application Information

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IPC IPC(8): C09J133/02C09J135/02C09J11/04C09J11/06C09J7/02C08L67/02C08L27/06C08L25/18C08K3/22C08K5/12C08F222/14C08F220/04C08F230/08C08F220/18C08F2/26C08F2/30
Inventor 夏超华
Owner 苏州市新广益电子股份有限公司
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