Resin composition, and cured product (2) thereof

Abstract

The present invention relates to a resin composition for sealing a surface of an organic electroluminescent (EL) element, said resin composition including: an alicyclic compound (A) having an oxetanyl group or an epoxy group; and a cyclic compound (B) which has an oxetanyl group or an epoxy group, and which satisfies the following condition (condition for cyclic compound (B): that the ring in cyclic compound (B) be either an aliphatic ring or a heterocycle, and in cases when the ring is an aliphatic ring, that the cyclic compound have a structure different to that of the compound used as alicyclic compound (A)). This resin composition for sealing a surface of an organic EL element exhibits an excellent liquid refractive index, and is cured by heat or energy rays such as light to obtain a cured product exhibiting excellent visible light transmission, excellent light resistance, a high Tg, low cure shrinkage, and a low water vapour transmission rate, and thus is particularly suitable as a surface sealant for an organic EL element.

Description

Background technique [0001] Recently, low moisture permeability materials are important materials in various industries. Especially in the electrical, electronic and display peripheral industries, it is an essential material to maintain quality, and a higher-performance low-moisture-permeability material is desired. [0002] In recent years, among displays, a thin display called a flat panel display (FPD), especially a plasma display (PDP) and a liquid crystal display (LCD) have been put into the market and widely used. In addition, organic electroluminescent (EL) displays (OLEDs) are expected to be put into practical use in some products as next-generation self-luminous thin-film displays. An organic EL element of an organic EL display has a structure in which an element part main body including a thin film laminate including a light-emitting layer sandwiched between a cathode and an anode is formed on a substrate such as glass on which a driving circuit such as a TFT is for...

AI Technical Summary

Problems solved by technology

However, since the glass sealing cover is produced by drilling a hole for inserting the desiccant into the flat glass substrate, the cost tends to increase.

In addition, when sealing with a sealing cap, since a desiccant is inserted inside the sealing cap, light cannot be extracted from the sealing cap side.

That is, the extraction of light emitted from the light source from the substrate side of the element is limited to bottom emission type elements

In the case of a bottom emission type element, there are problems in that the aperture ratio decreases due to the driver circuit portion formed on the substrate, and the extraction efficiency decreases due to the driver circuit portion blocking part of the light.

It is possible to use a known adhesive as an adhesive for sealing organic EL elements to perform sealing by a solid sealing method, but it is currently difficult to obtain a result that satisfies both reliability and productivity, and it is desired to develop a sealing adhesive suitable for the solid sealing method

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