Unlock instant, AI-driven research and patent intelligence for your innovation.

Resin composition, and laminate for printed circuit board comprising same

A resin composition, resin technology, applied in the directions of printed circuits, printed circuits, printed circuit manufacturing, etc., can solve the reduction of epoxy resin adhesion and heat resistance, heat resistance, insulation and formability limitations, metal Problems such as base layer oxidation

Active Publication Date: 2015-09-02
DOOSAN CORP
View PDF3 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, thermoplastic polyimide is cured under high temperature conditions, but such curing conditions will cause oxidation of the metal base layer and cause cracks (cracks) in PSR (Photo Solder Resist (photosolder resist)) when manufacturing printed circuit boards. ), epoxy resin has the problem of reduced adhesion and heat resistance due to compatibility problems with insulating films
[0005] On the other hand, in order to improve the adhesiveness and moldability, rubber (rubber) such as NBR (acrylonitrile-butadiene rubber) or CTBN (carboxyl terminated butadiene acrylonitrile) is mixed with epoxy resin. However, there are still limitations in obtaining the desired level of heat resistance, insulation, and moldability required in laminates for printed circuit boards.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Resin composition, and laminate for printed circuit board comprising same
  • Resin composition, and laminate for printed circuit board comprising same
  • Resin composition, and laminate for printed circuit board comprising same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～6 and comparative example 1～4

[0044] A printed circuit board with a metal base layer (aluminum foil) / first resin layer / thermosetting polyimide film / second resin layer / metal layer (copper foil) structure was produced by a method known in the art. At this time, resin compositions were prepared with the components and contents shown in Table 1 below, and then cured to form the first resin layer and the second resin layer.

[0045] [Table 1]

[0046]

experiment example

[0048] The resin compositions of Examples 1 to 6 and Comparative Examples 1 to 4, and the physical properties of each printed circuit board produced using the resin composition were evaluated by the following methods, and the results are shown in Table 2 below.

[0049] 1. Coatability

[0050] After coating (coating) the resin composition on the metal substrate (aluminum foil), the coated surface was evaluated for occurrence of fish eyes, pin holes, filler texture, and the like.

[0051] 2. Curing reactivity

[0052] After coating (coating) the resin composition on the metal base (aluminum foil), at 30kgf / cm 2 Curing was performed under pressure at 190° C. for 2 hours to form a first resin layer. Thereafter, the cured state of the formed first resin layer and the degree of adhesion between the first resin layer and the metal base layer (curled state) were visually evaluated.

[0053] 3. Punching processability (formability)

[0054] The prepared printed circuit board was h...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
epoxy equivalentaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The present invention relates to a resin composition acting as an insulation layer of a laminate for a printed circuit board while exhibiting adhesiveness to a metal base layer, wherein the resin composition comprises a rubber-modified epoxy resin, epoxy resin, inorganic filler, and hardener.

Description

technical field [0001] The present invention relates to a laminate used for a printed circuit board and a resin composition for forming an insulating layer and / or an adhesive layer contained in the laminate. Background technique [0002] The printed circuit board laminate includes a printed circuit layer that forms an electronic circuit and mounts electronic components such as semiconductors, an insulating layer that conducts heat released from the electronic components, and a heat radiation layer that contacts the insulating layer to release heat to the outside. [0003] In such a printed circuit board laminate, in order to improve electrical properties such as thermal conductivity and voltage resistance, and formability such as bendability (bending workability) and punchability, the metal base layer (functioning as a heat release layer) It is manufactured by laminating a flexible insulating film (functioning as an insulating layer), and in order to improve the adhesion bet...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/04C08L63/00B32B15/092H05K1/03
CPCH05K2201/0133H05K1/0353H05K2201/0209B32B15/092H05K1/036H05K3/0061H05K3/386B32B15/06B32B15/20B32B27/20B32B27/38B32B2264/102B32B2264/104B32B2307/206B32B2307/306B32B2307/718B32B2457/08C08G59/182C08K3/00C08L63/00C08L51/08H05K1/03C08L63/04H05K1/0373
Inventor 李亢锡韩德相郑允皓梁东宝
Owner DOOSAN CORP