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Adhesive film

A technology of adhesive film and resin composition, applied in the directions of adhesives, adhesive types, conductive adhesives, etc., can solve the problems such as the inability to improve the magnetic permeability of the core and the reduction of the inductance, and achieve excellent reliability and reduced magnetic properties. Loss and magnetic permeability improvement effect

Active Publication Date: 2015-09-16
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the core of the high-frequency sensor element with such a structure is non-magnetic, and the magnetic permeability (specific magnetic permeability) of the core cannot be increased. Therefore, when the sensor element is to be further miniaturized, it may be operated at a high frequency. Disadvantages of lower inductance (L value) reduction

Method used

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Examples

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Embodiment

[0240] Hereinafter, the present invention will be described more specifically based on examples and comparative examples, but the present invention is not limited to the following examples. In addition, "part" in the following description means "part by mass".

[0241]

[0242] Make liquid bisphenol A type epoxy resin (epoxy equivalent 190, specific gravity 1.2g / cm 3 , Mitsubishi Chemical Co., Ltd. "jER828EL") 20 parts, biphenyl type epoxy resin (epoxy equivalent 291, specific gravity 1.2g / cm 3 , Nippon Kayaku Co., Ltd. "NC3000H") 65 parts, phenoxy resin (weight average molecular weight 38000, specific gravity 1.2g / cm 3 , "YX6954" manufactured by Mitsubishi Chemical Co., Ltd., 30 parts of a 1:1 solution of methyl ethyl ketone (hereinafter referred to as "MEK") and cyclohexanone with 30% by mass of non-volatile components) were heated and dissolved in MEK while stirring 22.5 parts, 22.5 parts of cyclohexanone. A phenol novolak-based curing agent ("LA-7054" (a phenol-based ...

Embodiment 2

[0244] Except in Example 1, the inorganic filler (with an average particle diameter of 0.5 μm and a specific gravity of 2.2 g / cm 3 The amount of silica treated with an aminosilane-based coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) for "SO-C2" manufactured by Admatex Co., Ltd. was 160 parts, and the magnetic filler (Epson Atomic "AW2-08PF3F" manufactured by Su Co., Ltd., average particle size 3.0 μm, specific gravity 7.0 g / cm 3 ) except that the amount was 350 parts, an adhesive film was obtained in the same manner as in Example 1.

Embodiment 3

[0246] Except in Example 1, the inorganic filler (with an average particle diameter of 0.5 μm and a specific gravity of 2.2 g / cm 3 The amount of silica treated with an aminosilane-based coupling agent ("KBM573" manufactured by Shin-Etsu Chemical Co., Ltd.) for "SO-C2" manufactured by Admatex Co., Ltd. was 90 parts, and the magnetic filler (Epson Atomic "AW2-08PF3F" manufactured by Su Co., Ltd., average particle size 3.0 μm, specific gravity 7.0 g / cm 3 ) was 290 parts, an adhesive film was obtained in the same manner as in Example 1.

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Abstract

An adhesive film capable of forming an insulating layer is provided. The insulating layer improves magnetoconductivity, reduces magnetic loss and is excellent in reliability. The adhesive film comprises a support body and a resin composition layer arranged on the support body, wherein the resin composition layer contains (A) thermosetting resin, (B) magnetic filler, and (C) inorganic filling material. When the involatile constituent in the resin composition of the resin composition layer is set as 100 volume %, the content B is greater than 100 volume %, and the content of the C divided by the content B falls in the scope of 0.3-3.0.

Description

technical field [0001] The present invention relates to an adhesive film, a wiring board, and a method for manufacturing the wiring board. Background technique [0002] A large number of sensor elements called power inductors, inductors for high frequency bands, and common mode choke coils are installed in information terminals such as mobile phones and smartphones. At present, as an inductor element for a high-frequency band whose operating signal frequency is 1 GHz or more, especially in the range of 1 GHz to 3 GHz, for example, a winding structure in which a coil is wound on a core member; a laminate in which a coil conductor is laminated on a core member are known. Layer structure; forming a wiring layer constituting a part of the coil on each insulating layer of a multi-layered shape, stacking the insulating layers forming the wiring layer so that the wiring layers are electrically connected to each other, within the thickness of the insulating part The membrane struct...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J163/00C09J11/04H05K1/02H05K1/16
CPCC09J9/02C09J11/04C09J11/06C09J163/00C09J2203/326C09J7/20
Inventor 大山秀树林荣一
Owner AJINOMOTO CO INC
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