Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Preparation method of superconducting wire rod

A superconducting wire and superconducting layer technology, applied in the manufacture/processing of superconductor devices, etc., can solve problems affecting the superconducting performance of superconducting wires, increase contact resistance, etc., and achieve the effect of uniform thickness and uniform thickness

Inactive Publication Date: 2015-09-16
富通集团(天津)超导技术应用有限公司 +2
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The uneven thickness of the central part 51 and the edge part 21 of the Cu layer will increase the contact resistance of the welding part when the obtained superconducting wire is welded to the electrode, which will affect the superconducting performance of the superconducting wire

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Preparation method of superconducting wire rod
  • Preparation method of superconducting wire rod

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0014] The invention provides a method for preparing a superconducting wire, comprising:

[0015] The step of forming an intermediate layer on the substrate; the step of forming a superconducting layer on the intermediate layer; the step of forming a silver stabilizing layer on the superconducting layer; immersing the silver stabilizing layer into an aqueous copper sulfate solution after forming the silver stabilizing layer and passing The copper plating treatment step of electroplating to form a copper stable layer on the silver stable layer is characterized in that the copper sulfate aqueous solution contains copper sulfate pentahydrate, sulfuric acid, chloride ions, nonionic surfactants and anionic surfactants. .

[0016] see figure 2 , figure 2 Schematic diagram of the structure of the superconducting wire provided by the embodiment of the present invention, wherein 1 is the substrate, 2 is the intermediate layer formed on the substrate 1, 3 is the superconducting laye...

Embodiment 1

[0036] On a Ni alloy substrate (Hastelloy (registered trademark) strip) sequentially use the sputtering method to form Al 2 o 3 layer, sputtering method to form Y 2 o 3 layer, IBAD method to form MgO layer, sputtering method to form LaMnO 3 layer and sputtering method to form CeO 2 layer; in CeO 2 A YBaCuO superconducting layer is formed on the layer by a MOD method; an Ag layer is formed by a sputtering method to form a superconducting wire with an Ag layer structure.

[0037] The wire is immersed in 20°C, 5mL / L sulfuric acid solution for 10s, and then washed with water for 10s; the washed superconducting wire is used as a cathode for electroplating in an aqueous copper sulfate solution to form a 15 μm thick Cu layer on the Ag layer, The copper sulfate aqueous solution includes 200g / L copper sulfate pentahydrate, 80g / L sulfuric acid, 300ppm potassium chloride, 0.3g / L polyethylene glycol and 0.05g / L sodium lauryl sulfate, the copper sulfate aqueous solution The temperatu...

Embodiment 2

[0041] The superconducting wire was prepared by the same method as in Example 1, except that the superconducting wire formed with the Ag layer was immersed in a 5 mL / L hydrochloric acid solution at 20° C. for 10 s, and then washed with water for 10 s.

[0042] After the surface is copper-plated, the peel strength and Ic value of the superconducting wire are measured, and the results are shown in Table 1. Table 1 is the test results of the peel strength and Ic value of the superconducting wire provided by the embodiment of the present invention;

[0043] After the copper plating on the surface, the film thickness of the central part and the film thickness of the edge part of the Cu layer of the superconducting wire were measured, and the results are shown in Table 2. Table 2 shows the film thickness of the Cu layer on the surface of the superconducting wire provided by the embodiment of the present invention.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a preparation method of a superconducting wire rod. The method includes the following steps that: an intermediate layer is formed on a substrate; a superconducting layer is formed on the intermediate layer; a silver stabilization layer is formed on the superconducting layer; and copper plating processing is performed: after the silver stabilization layer is formed, the substrate is impregnated by a copper sulfate aqueous solution, so that a copper stabilization layer can be formed on the silver stabilization layer through electroplating, wherein the copper sulfate aqueous solution contains blue vitriol, sulfuric acid, chloride ions, a nonionic surfactant and an anionic surfactant. According to the preparation method of the invention, the nonionic surfactant and the anionic surfactant are added in the copper plating solution, so that the Cu layer can be obtained on the Ag layer, the thickness of the Cu layer along the width direction of the Cu layer is uniform, and the thickness of the center and edge of the Cu layer is uniform, and therefore, the contact resistance of welding portions of the superconducting wire rod and an electrode when the superconducting wire rod and the electrode are welded to each other will not be affected, and the superconducting performance of the superconducting wire rod will not be affected.

Description

technical field [0001] The invention belongs to the technical field of superconducting wires, and in particular relates to a preparation method of superconducting wires. Background technique [0002] Superconducting materials are materials that exhibit the property of zero resistance under certain low temperature conditions, and are widely used in the production of magnets and power cables. [0003] With the development of superconducting materials, the second-generation superconducting wires appear. Its typical structure consists of a substrate, a buffer layer, a superconducting layer and a stabilization layer. Among them, the substrate is the support of the entire superconducting wire; the buffer layer and It is called the middle layer, and its role is to provide texture for the growth of the superconducting layer; the superconducting layer is formed of superconducting materials and is the carrier of current; the stabilization layer is also called the stable layer, and its...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L39/24C25D7/06C25D3/38
Inventor 王醒东青木裕治长谷川隆代
Owner 富通集团(天津)超导技术应用有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com