Single-cylinder type desktop type laser area selecting fusion forming device and control method
A technology of laser selective melting and forming equipment, which is applied in the direction of additive processing, etc., can solve the problems that the structural design does not consider the recovery and cleaning of precious metal powder, is not suitable for fine precious metals, and increases production costs, so as to achieve the promotion of development, volume and The overall weight is reduced and the effect of saving production costs
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0042] In order to make the object, technical solution and advantages of the present invention more clear and definite, the present invention will be further described in detail below with reference to the accompanying drawings and examples.
[0043] Such as Figure 1-8 As shown, the single-cylinder desktop laser selective melting molding equipment includes a molding platform 100, a mobile platform 200, a laser 300, an optical transmission device, a molding substrate 500, a powder holding device 600, a powder spreading device 700, a powder taking device, and a protective cover 720 and control system; the molding platform 100 is fixedly arranged in the cavity of the closed molding chamber 400, and the molding platform 100 is provided with a through hole that runs through the entire molding platform 100; the mobile platform 200 is arranged on the molding platform 100, and moves along the The forming platform 100 moves linearly; the powder taking device includes a base 710 and a ...
PUM
Property | Measurement | Unit |
---|---|---|
size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com