A ceramic substrate for LED

A technology of ceramic substrate and glass sintering aid, which is applied in the field of ceramic substrates for LEDs, can solve the problems of LED luminous efficiency attenuation, LED life impact, etc., and achieve the effects of optimizing physical and chemical properties, enhancing porcelain forming performance, and facilitating industrialization

Inactive Publication Date: 2017-02-22
GANSU RONGBAO IND GRP
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has been paid more and more attention (too high temperature will lead to the attenuation of LED luminous efficiency); fatal impact

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

Embodiment 2

Embodiment 3

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
particle diameteraaaaaaaaaa
Login to view more

Abstract

The invention discloses a ceramic substrate for LEDs. Various raw materials used in the LTCC preparation technology are optimized, aluminum nitride, boron nitride, alumina and beryllium oxides serve as the main raw materials, meanwhile, glass sintering additives, copper and aluminum alloy nano-particles, rare earth oxides, solvents, plasticizer, dispersant, binder and other additives are added, and the physical and chemical properties of the ceramic substrate are further optimized. The thermal conductivity of the ceramic substrate is larger than 400 W / (m*k), the bending strength is larger than 300 Mpa, and the dielectric constant is smaller than 2. Meanwhile, due to a conventional LTCC preparation method, the main raw materials and the additives can be prepared into the high-conductivity ceramic substrate, the preparation technology is simple, and industrialization is facilitated.

Description

A ceramic substrate for LED technical field The invention belongs to the field of substrates for LEDs, in particular to a ceramic substrate for LEDs. Background technique As the fourth-generation lighting source, light-emitting diodes (LEDs) are valued by countries all over the world for their advantages such as low maintenance costs, long life, good shock resistance, low power consumption, and environmental friendliness. They are widely used in indicator lights, display screens, Backlighting, landscape lighting, transportation, etc., the market potential is huge. As the demand for LED lighting becomes more and more urgent, the heat dissipation problem of high-power LEDs has been paid more and more attention (too high temperature will lead to the attenuation of LED luminous efficiency); Fatal impact. At present, there are four kinds of ceramic heat dissipation substrates that are more common: direct copper clad ceramic board (DBC), direct copper clad substrate (DPC), hi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/581C04B35/583C04B35/10C04B35/63C04B35/64
Inventor 张宝
Owner GANSU RONGBAO IND GRP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap