Laser micro-processing device and method thereof

Abstract

The invention relates to a laser micro-processing device and method. The laser micro-processing device comprises a rotating table and a container located on the rotating table, a lower ultrasonic vibrating table is installed at the bottom of the container, an upper ultrasonic vibrating table is fixed to the lower ultrasonic vibrating table, a workpiece is placed on the upper ultrasonic vibrating table, a laser source and a lens are arranged above the upper ultrasonic vibrating table, laser beams penetrate through the lens and reach the surface of the workpiece, an ultrasonic horn is arranged on the upper side of the upper ultrasonic vibrating table and sends ultrasonic waves to the surface of the workpiece, an outer container is connected with the container through a liquid inflow pipe and a liquid outflow pipe, and a spraying nozzle on the liquid inflow pipe faces the surface of the workpiece. When the surface of the workpiece in liquid is immersed in laser irradiation, the ultrasonic horn irradiates the surface of the workpiece or the workpiece is made to generate ultrasonic vibration in the vertical direction and the horizontal direction. Laser and the ultrasonic waves ideally act on the first surface of the workpiece at the same time, different processing effects are achieved, the ultrasonic cavitation phenomenon and the water jetting phenomenon can be intensified, the surface of the workpiece can be cleaned again, and heat-affected zones of processing, cracks and deposition of chippings are reduced.

Description

technical field [0001] The invention relates to a laser micromachining device and a method thereof, belonging to the technical field of laser micromachining. Background technique [0002] The field of micromachining generally refers to the creation and modification of features by removing material from microscopic workpieces. Laser processing technology is a common laser micro-processing technology. Laser micromachining has many advantages, including good flexibility (controllability of the beam scanning trajectory path), non-contact processing (the laser beam is the main processing tool and does not contact the workpiece), high resolution (less than 10 microns ). Therefore, laser micromachining has many existing and potential applications, including but not limited to, eg, medical devices, solar cells, and surface microtexturing of mechanical parts for improved tribological properties. [0003] At the same time, one or more of the following defects still exist in current...

AI Technical Summary

Problems solved by technology

[0005] 2) Laser-induced thermal effect defects, including surface oxide layer, recast layer, heat-affected zone, cracks, etc.;

[0006] 3) The harmful surface residual tensile stress reduces the mechanical properties of parts and can also be regarded as another defect form of laser-induced thermal effect

[0007] In the process of processing, the above disadvantages are difficult to reduce or remove, which increases the difficulty, time and cost of processing

Images