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Ultrasonic-vibration-assisted fiber array end face polishing device

A technology of ultrasonic vibration and optical fiber array, applied in the direction of grinding devices, grinding machine tools, metal processing equipment, etc., can solve the problems of incomplete utilization of polishing liquid and low polishing efficiency, and achieve improved polishing and grinding efficiency, lifting effect, and impact speed Bigger effect

Inactive Publication Date: 2015-09-30
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem solved by the present invention is to provide a novel ultrasonic vibration-assisted optical fiber array end face polishing device for the defects of incomplete utilization of the polishing solution and low polishing efficiency in the existing single chemical mechanical polishing fiber array end face

Method used

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  • Ultrasonic-vibration-assisted fiber array end face polishing device
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  • Ultrasonic-vibration-assisted fiber array end face polishing device

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Embodiment Construction

[0023] see figure 2 , the ultrasonic vibration-assisted optical fiber array end face polishing device in the figure includes a polishing table base 16, a polishing pad 15, a polishing fixture 12, a polishing liquid tank 1 and an auxiliary ultrasonic device. The polishing pad 15 is rotatably arranged on the base 16 of the polishing table, and the bottom of the polishing pad 15 is connected with a motor 17 to drive the polishing pad 15 to rotate. The polishing jig 12 is disc-shaped. During the polishing process, the optical fiber array assembly is used as the workpiece 18, clamped at the circumference of the disc, placed vertically, and clamped by screw fastening, which is convenient for workpiece loading and unloading and processing. The polishing jig 12 is placed On the polishing pad 15, the end face of the workpiece to be polished is in contact with the polishing pad 15 under the action of gravity, and the polishing liquid tank 1 transports the polishing liquid to the top of...

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Abstract

The invention discloses an ultrasonic-vibration-assisted fiber array end face polishing device. The device comprises a rotatable polishing cushion and a polishing clamp arranged on the polishing cushion, wherein a workpiece (a fiber array assembly) is clamped on the polishing clamp, a to-be-polished end face of the workpiece is contacted with the polishing cushion under the action of gravity, and a polishing solution is introduced to the polishing cushion; the polishing clamp is arranged on the polishing cushion through a support platform elastically arranged in the vertical direction, the vertical end of the polishing clamp is connected with an ultrasonic transducer through an amplitude-change pole, and the ultrasonic transducer is connected with an ultrasonic generator through a wire. The polishing grinding efficiency of the polishing solution can be improved through chemico-mechanical polishing of an ultrasonic-vibration-assisted fiber array end face, the consumption of the polishing solution is reduced, the production cost is saved, and influences of the polishing solution on the environment are reduced; meanwhile, the polishing effect can be effectively improved, and the device can be widely used in actual production.

Description

technical field [0001] The invention belongs to the technical field of optical fiber array precision processing, in particular to an ultrasonic vibration-assisted optical fiber array end face polishing device. Background technique [0002] The optical fiber array component is a key component of integrated optoelectronic devices. It is connected with the optical path of optoelectronic chips by direct docking coupling method, and is responsible for the important task of optical signal transmission. The end face of the optical fiber array component is a heterogeneous structure surface composed of a variety of different materials, and the materials involved include V-groove (single crystal Si), optical fiber (SiO 2 ), top cover (borosilicate heat-resistant glass), UV curing glue, etc. Among them, monocrystalline silicon and glass are hard and brittle materials that are difficult to process, and their processing properties are different, which brings great difficulties to precis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/04B24B37/34
CPCB24B1/04B24B37/34
Inventor 刘德福佘亦曦严日明
Owner CENT SOUTH UNIV
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