Heat-reduction metallization copper plating process for carbon fiber surface

Abstract

The invention discloses a heat-reduction metallization copper plating process for a carbon fiber surface, which belongs to the technical field of modification methods for the carbon fiber surface. The process comprises the following steps: pretreatment of a carbon fiber; preparation of a pre-plating liquid; dipping; heat-reduction copper plating; etc.; wherein the process is carried out in a micro-aerobic carbon environment, N2 is used as protection and dilution gas, reduction temperature is 650 to 700 DEG C, reduction time is 40 to 50 min, and the pH value of the pre-plating liquid is 11 to 12. Compared with chemical copper plating and electrical copper plating of the carbon fiber, the copper plating process provided by the invention has the following advantages: since a micro-aerobic carbon atmosphere is employed for reduction of a copper salt, the two major steps of sensitization and activation before copper plating are omitted, usage of precious metals like AgNO3 and PdCl2 is reduced, experiment cost is reduced, and a pretreatment step is simplified. According to XRD and EDS analysis, a great amount of copper is attached onto the carbon fiber surface after copper plating, reaching a certain coverage ratio; and according to SEM observation results, the copper on the carbon fiber surface is distributed on the carbon fiber surface in a superposed island shape.

Description

technical field [0001] The invention relates to the technical field of carbon fiber surface modification methods, in particular to a carbon fiber surface thermal reduction metallization copper plating process using the property that copper salts are reduced at high temperatures in a micro-oxygen and carbon-containing atmosphere. Background technique [0002] PAN-based carbon fiber (Carbon fiber) is a fiber made of polyacrylonitrile fiber through polymerization, spinning, pre-oxidation, carbonization and other processes, with high carbon content. It has excellent electrical and thermal conductivity, high specific strength, good toughness, high electromagnetic shielding, and small expansion coefficient. Carbon fiber is widely used as a reinforced composite material in industry, aerospace, new energy and other fields. [0003] The research on carbon fiber surface metallization can promote the development of carbon fiber metal matrix composites. Copper plating is a suitable sur...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a carbon fiber surface thermal reduction metallized copper plating process to solve the problems of high cost, pretreatment steps and complex control of reducing atmosphere in the conventional carbon fiber surface copper plating method in the prior art

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