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High voltage-resistance organic silicon encapsulating material for ceramic thermistor

A thermistor and silicone technology, which is applied in the field of encapsulation materials for ceramic resistors, can solve problems such as slivers, achieve a firm contact layer, and avoid the effect of ceramic body fragmentation

Inactive Publication Date: 2015-10-21
常熟市林芝电子有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

According to the applicant's test, the ceramic thermistor using the encapsulation material still cracks in 10 electrical performance tests at 4KV, 10 / 700μs, and 60s interval

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] The composition of encapsulating material, its composition includes main material (by mass percentage): Silicone resin α, ω-dihydroxy polydimethylsiloxane 13%, quartz powder 80%, PTC base material powder 3%, hydrogen Aluminum oxide 3%, silica powder 1%; wherein PTC base material powder comprises the following components in terms of molar fractions: 70 parts of BaCO 3 , 7 parts of SrCO 3 , 8 parts of PbO, 8 parts of CaCO 3 , 100 parts of TiO 2 , 0.03 parts of Sb 2 o 3 , 0.05 parts of Nb 2 o 5 , 0.1 parts of Al 2 o 3 . According to the ceramic PTC process: after granulation, it is directly sintered, refined by ball milling and then dried to make powder, the particle size of powder is D50<1.5μm.

[0018] Auxiliary materials (accounting for the mass percentage of the main material): 2% titanate coupling agent, 2% accelerator, 1% curing agent, 3.0% blue pigment, the solute of the liquid encapsulating material is composed of the above main and auxiliary materials.

...

Embodiment 2

[0022] The composition of encapsulating material, its composition includes main material (by mass percentage): Silicone resin α, ω-dihydroxy polydimethylsiloxane 18%, quartz powder 75%, PTC base material powder 3%, hydrogen Aluminum oxide 3%, silica powder 1%; wherein PTC base material powder comprises the following components in terms of molar fractions: 75 parts of BaCO 3 , 8 parts of SrCO 3 , 9 parts of PbO, 9 parts of CaCO 3 , 105 parts of TiO 2 , 0.06 parts of Sb 2 o 3 , 0.08 part Nb 2 o 5 , 0.5 parts of Al 2 o 3 . According to the ceramic PTC process: after granulation, it is directly sintered, refined by ball milling and then dried to make powder, the particle size of powder is D50<1.5μm.

[0023] Auxiliary materials (accounting for the mass percentage of the main material): 2% titanate coupling agent, 2% accelerator, 1% curing agent, 3.5% yellow pigment, the solute of the liquid encapsulating material is composed of the above main and auxiliary materials.

[...

Embodiment 3

[0027] The composition of encapsulation material, its composition includes main material (by mass percentage): Silicone resin α, ω-dihydroxypolydimethylsiloxane 10%, quartz powder 85%, PTC base material powder 2%, hydrogen Aluminum oxide 2%, silica powder 1%; wherein PTC base material powder comprises the following components in terms of molar fractions: 72 parts of BaCO 3 , 8 parts of SrCO 3 , 8 parts of PbO, 8 parts of CaCO 3 , 103 parts of TiO 2 , 0.04 parts of Sb 2 o 3 , 0.07 parts Nb 2 o 5 , 0.4 parts of Al 2 o 3 . According to the ceramic PTC process: after granulation, it is directly sintered, refined by ball milling and then dried to make powder, the particle size of powder is D50<1.5μm.

[0028] Auxiliary materials (accounting for the mass percentage of the main material): 2.5% titanate coupling agent, 1.5% accelerator, 0.5% curing agent, and 1.0% blue pigment. The solute of the liquid encapsulating material is composed of the above main and auxiliary materia...

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PUM

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Abstract

The invention discloses a high voltage-resistance organic silicon encapsulating material for a ceramic thermistor. The high voltage-resistance organic silicon encapsulating material comprises a solute and a solvent, wherein the solute comprises main materials and auxiliary materials. The main materials comprise, by mass, 10-20% of organic silicon resin alpha, omega-dyhydroxy polydimethylsiloxane, 75-85% of quartz powder, 2-5% of PTC base stock powder, 2-5% of aluminum hydroxide and 1-3% of silicon powder. The auxiliary materials comprise, by the total mass of the main materials, 2-2.5 % of titanate coupling agent, 1.5-3.5% of accelerant, 0.5-2.0% of curing agent and 1-3.5% of pigment. For the ceramic thermistor made of the encapsulating material, the phenomenon of ceramic body fragmentation caused by the expansion factor is avoided on the performance of bearing high voltage and large current.

Description

technical field [0001] The invention relates to an encapsulating material for ceramic resistors, in particular to a high-voltage-resistant organic silicon encapsulating material for ceramic thermistors. Background technique [0002] For a long time, the packaging materials of domestic ceramic thermistors have been mainly made of organic resins, which have been widely used in general application fields. However, there are restrictions on the high-end application fields of thermistors, especially the lightning resistance performance of the circuit protection of telecom voice line cards and the high requirements for the dielectric strength of the encapsulation layer. However, with the continuous development of domestic silicone resin material application technology , especially the research and development of the high insulation and electrical properties of silicone resin, so that in the circuit protection of telecommunication voice cards ① the dielectric strength of the encaps...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/06C08K13/02C08K3/36C08K3/22C08K5/10C08K3/26
Inventor 何正安廖园富汪鹰
Owner 常熟市林芝电子有限责任公司
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