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Thick-film circuit resistance paste for stainless steel substrate and preparing method thereof

A thick film circuit, resistive paste technology, applied in conductive materials, circuits, cables/conductors dispersed in non-conductive inorganic materials, etc., can solve problems such as high price, small square resistance coverage, and limited material application. , to achieve the effect of reducing production cost and use cost, realizing large-scale industrial production, and simple operation of preparation process

Active Publication Date: 2015-10-21
NINGBO POLYTECHNIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the silver-palladium resistance paste has good electrical conductivity and suitable temperature coefficient of resistance, the square resistance coverage of the resistance paste is small, the process reproducibility is poor, the TCR is large when the resistance is high, and the silver ion migration resistance And the corrosion resistance of solder is poor, these shortcomings greatly limit the application of materials in thick film circuits, and the price of precious metals such as silver and palladium is also very expensive

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] Weigh 40g Cu(OH) 2 and 28gGe(OH) 4 Mix evenly, place in a high-temperature electric furnace, heat up to 1450°C at a heating rate of 8°C / min, keep warm for 4 hours, and after cooling, ball mill to an average diameter of 0.5μm, and the prepared Cu 2 O-GeO 2 Composite powder and 0.15μm Cu powder are fully mixed at a mass ratio of 40:60 to form a conductive phase Cu 2 O-GeO 2 Composite + Cu powder.

[0029] Weigh 37gSiO 2 , 20gAl 2 o 3 , 7gB 2 o 3 , 28gCaO, 6gZrO 2 , 2gCo 2 o 3 , mixed evenly, placed in a high-temperature electric furnace, heated to 1550°C at a heating rate of 10°C / min, kept for 2 hours, then water quenched, and ball milled to 3 μm to obtain a glass-ceramic phase SiO 2 -Al 2 o 3 -B 2 o 3 -CaO-ZrO 2 -Co 2 o 3 Complex powder.

[0030] Conductive phase Cu 2 O-GeO 2 Composite + Cu powder, glass-ceramic phase SiO 2 -Al 2 o 3 -B 2 o 3 -CaO-ZrO 2 -Co 2 o 3 The compound and the organic liquid phase are placed in a container at a mass ...

Embodiment 2

[0032] Weigh 45gCu(OH) 2 and 26gGe(OH) 4 Mix evenly, place in a high-temperature electric furnace, heat up to 1500°C at a heating rate of 10°C / min, keep warm for 2 hours, and after cooling, ball mill to an average diameter of 0.8μm, and the prepared Cu 2 O-GeO 2 Composite powder and 0.2μm Cu powder are fully mixed at a mass ratio of 45:55 to form a conductive phase Cu 2 O-GeO 2 Composite + Cu powder.

[0033] Weigh 30gSiO2 2 , 24gAl 2 o 3 , 8gB 2 o 3 , 30gCaO, 5gZrO 2 、3gCo 2 o 3 , mixed evenly, placed in a high-temperature electric furnace, heated to 1600°C at a heating rate of 12°C / min, kept for 1.5h, then water quenched, and ball milled to 2.5μm to obtain a glass-ceramic phase SiO 2 -Al 2 o 3 -B 2 o 3 -CaO-ZrO 2 -Co 2 o 3 Complex powder.

[0034] Conductive phase Cu 2 O-GeO 2 Composite + Cu powder, glass-ceramic phase SiO 2 -Al 2 o 3 -B 2 o 3 -CaO-ZrO 2 -Co 2 o 3 The powder and the organic liquid phase are placed in a container at a mass ratio of...

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Abstract

The invention discloses a thick-film circuit resistance paste for a stainless steel substrate and a preparing method thereof. The thick-film circuit resistance paste is composed of two parts of a solid phase component and an organic liquid phase; the solid phase component comprises a conductive phase and a microcrystalline glass phase, the conductive phase is composed of Cu2O-GeO2 compound +Cu powder, and the microcrystalline glass phase is a SiO2-Al2O3-B2O3-CaO-ZrO2-Co2O3 compound; and the organic liquid phase is a mixed liquid phase of terpineol, tributyle citrate, ethyl cellulose, span 85, 1,4-butyrolactone and a hydrogenated castor oil. The preparing method of the thick-film circuit resistance paste comprises firstly preparing the conductive phase and the microcrystalline glass phase respectively, preparing the organic liquid phase then, finally performing mixing modulation of the conductive phase, the microcrystalline glass phase and the organic liquid phase, and then the resistance paste can be obtained.

Description

technical field [0001] The invention relates to the technical field of thick-film circuits, in particular to a thick-film circuit resistance paste for stainless steel substrates and a preparation method thereof. Background technique [0002] With the extensive application of thick-film high-power circuits, thick-film high-power resistors and their power modules are also widely used in circuits such as power control, overload protection and power distribution. High-power thick film resistors have the advantages of small size, light weight, high power density, reliable performance, flexible design, good controllability, long service life, environmental protection and energy saving, and high cost performance. They gradually occupy the mainstream position in the market, and their application fields have expanded to The market prospects are very broad in military, automotive electronics, communications, aerospace, home appliances, medical and chemical industries. Thick film resi...

Claims

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Application Information

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IPC IPC(8): H01B1/20H01B1/22H01B13/00
Inventor 袁正勇
Owner NINGBO POLYTECHNIC
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