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Aqueous working fluid

一种加工液、水性的技术，应用在金属加工设备、制造工具、石油工业等方向，能够解决钢丝变细、切割损耗变大、生产率存在问题等问题，达到发泡少、良好切断精度的效果

Inactive Publication Date: 2015-10-28
IDEMITSU KOSAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this free abrasive method, when the steel wire is thick, the cutting loss increases, so a large amount of cutting powder is generated, and the yield when cutting the silicon ingot is deteriorated.
In addition, the steel wire is gradually reduced as it is used, so there is a limit to making the steel wire itself thinner
Therefore, there is a problem with the productivity of the free abrasive method in the production of silicon wafers for solar cell applications where a large increase in production is expected in the future.

Method used

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  • Aqueous working fluid
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1~6

[0058] [Examples 1-6, Comparative Examples 1-6]

[0059] Aqueous machining fluids (test fluids) having the compounding compositions shown in Tables 1 and 2 were prepared, and the cutting processing and evaluations shown below were performed. The evaluation results are shown in Table 1 and Table 2 together.

[0060]

[0061]

[0062] 1) EO adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol

[0063] 2) EO adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol

[0064] 3) EO adducts of 2,5,8,11-tetramethyl-6-dodecyne-5,8-diol

[0065] 4) EO adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol

[0066] 5) Newport PE64 manufactured by Sanyo Chemical Industry Co., Ltd.

[0067] 6) Naroakti CL-120 manufactured by Sanyo Chemical Industry Co., Ltd.

[0068] (processing methods)

[0069] Silicon wafers were obtained by cutting the silicon ingot while flowing the test solution through the bonded abrasive wire saw. The specific conditions are as follows.

[0070] Cutting machine: WSD-K2 (m...

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Abstract

An aqueous working fluid according to the present invention can be used in the cutting of a brittle material using a wire saw, and is characterized by being prepared by adding an alkylene oxide adduct of acethylene glycol and a glycol to water. When the aqueous working fluid according to the present invention is used in the cutting of a brittle material using a wire, good cutting accuracy can be achieved. Therefore, the aqueous working fluid according to the present invention can be used suitably in the cutting of a wafer having a large diameter. The aqueous working fluid according to the present invention can be used suitably particularly for a wire saw of a fixed abrasive type.

Description

technical field [0001] The present invention relates to an aqueous machining fluid, and more specifically, to an aqueous machining fluid used when cutting brittle materials with a wire saw. Background technique [0002] In the manufacture of semiconductor products, silicon ingots, which are brittle materials, need to be cut. From the viewpoint of cutting accuracy and productivity, wire saws are usually used for processing. Here, for cutting the silicon ingot, there are the following methods: the free abrasive method of cutting the silicon ingot in the state where the abrasive is dispersed in the machining fluid (cutting fluid), and the state in which the abrasive is fixed to the surface of the steel wire in advance. Consolidated abrasive grains for cutting off silicon ingots. [0003] Examples of machining fluids used in the free abrasive system include water-soluble machining fluids containing friction coefficient reducing agents, antirust ability additives, and the like. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C10M173/02B24B27/06C10M105/14C10M107/34C10M145/26H01L21/304C10N20/00C10N20/04C10N30/00C10N40/22
CPCC10M107/34C10M105/14C10M145/26C10M173/02C10M2207/022C10M2209/104C10N2220/021C10N2230/12C10N2240/401C10N2020/04C10N2030/12C10N2040/22C10M105/08C10M105/18
Inventor 北村友彦
Owner IDEMITSU KOSAN CO LTD