Blackened surface-treated copper foil, method for manufacturing blackened surface-treated copper foil, copper-clad laminate and flexible printed circuit board

A surface treatment and flexible printing technology, which is applied to printed circuits, printed circuits, printed circuit components, etc., can solve problems such as difficulty in ensuring light transmission, inability to obtain fine-pitch circuit formation performance, etc., to shorten the time of over-etching, The effect of good etch coefficient and good etch characteristics

Active Publication Date: 2015-10-28
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the present invention, the glossiness [Gs(60°)] is 70 or more, and when the glossiness is lower than 70, good fine-pitch circuit formation performance cannot be obtained, and it is difficult to ensure the required performance when detecting with an automatic optical inspection device (AOI device). Good Light Transmittance" Technical Matters

Method used

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  • Blackened surface-treated copper foil, method for manufacturing blackened surface-treated copper foil, copper-clad laminate and flexible printed circuit board
  • Blackened surface-treated copper foil, method for manufacturing blackened surface-treated copper foil, copper-clad laminate and flexible printed circuit board
  • Blackened surface-treated copper foil, method for manufacturing blackened surface-treated copper foil, copper-clad laminate and flexible printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] In Example 1, blackened surface-treated copper foil was produced by performing black roughening, antirust treatment, and silane coupling agent treatment after producing an electrolytic copper foil with a thickness of 12 μm, and compared it with a comparative example described later.

[0053] Manufacture of electrolytic copper foil: Copper electrolyte uses sulfuric acid copper sulfate solution with the following composition, cathode uses titanium rotating electrode with surface roughness Ra=0.20μm, anode uses DSA, at solution temperature 45 ° C, current density 55A / dm 2 Electrolysis was performed to obtain an electrolytic copper foil having a thickness of 12 μm. The maximum height difference (Wmax) of the undulation of the deposition surface of this electrolytic copper foil was 0.8 micrometers.

[0054] Copper concentration: 80g / L

[0055] Free sulfuric acid concentration: 140g / L

[0056] Concentration of bis(3-sulfopropyl)disulfide: 30mg / L

[0057] Diallyldimethylam...

Embodiment 2

[0069] In Example 2, after producing an electrolytic copper foil with a thickness of 12 μm, the same black roughening, antirust treatment, and silane coupling agent treatment as in Example 1 were performed to produce a blackened surface-treated copper foil.

[0070] Manufacture of electrolytic copper foil: with the bis(3-sulfopropyl) disulfide concentration of embodiment 1 changed to the sulfuric acid copper sulfate solution of 20mg / L as copper electrolytic solution, obtained under the same conditions as embodiment 1 Electrolytic copper foil with a thickness of 12 μm. The maximum height difference (Wmax) of the undulation of the deposition surface of this electrolytic copper foil was 1.2 micrometers.

[0071] Using the above-mentioned electrolytic copper foil, the same black roughening, antirust treatment, and silane coupling agent treatment as in Example 1 were performed to obtain the blackened surface-treated copper foil of Example 2. Each characteristic evaluated is shown ...

Embodiment 3

[0073] In Example 3, blackened surface-treated copper foil was produced by performing black roughening, antirust treatment, and silane coupling agent treatment using the same electrolytic copper foil as in Example 1. Hereinafter, only black roughening which is different from Example 1 will be described.

[0074] Black roughening: Pre-roughening treatment was given to the deposition surface side among the electrode surface and the deposition surface which the above-mentioned electrolytic copper foil has. The pre-roughening treatment at this time is performed in the following two steps.

[0075] In the first stage of pre-roughening treatment, use a copper electrolytic solution for roughening treatment with a copper concentration of 18g / L and a free sulfuric acid concentration of 70g / L, at a solution temperature of 25°C and a current density of 4A / dm 2 Wash with water after 4 seconds of electrolysis. Subsequently, in the second stage, using a copper electrolytic solution with a...

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Abstract

The purpose of the present invention is to provide a copper foil for a printed circuit board, the copper foil having: a blackened surface capable of improving CCD visibility during terminal connection processing and precision of flexible printed circuit board AOI detection; an appropriate roughness suitable for manufacturing flexible printed circuit boards; and favorable etching properties. To achieve said purpose, a blackened surface-treated copper foil, etc. for manufacturing flexible printed circuit boards is used, the foil being characterized in that the roughened surface of the surface-treated copper foil with a roughened surface is a black roughened surface for which the maximum high-low difference of the undulations (Wmax) is 1.2 µm or less and which is provided with a color tone having a L*a*b* color system lightness (L*) of 30 or less.

Description

technical field [0001] The application relates to a blackened surface-treated copper foil, a manufacturing method of the blackened surface-treated copper foil, a copper-clad laminate obtained by using the blackened surface-treated copper foil, and a flexible printed circuit board. In particular, this application relates to the surface-treated copper foil which performed the fine roughening process which blackened the copper foil surface. Background technique [0002] Conventionally, AOI (Automatic Optical Inspecter) has been widely used for automatic inspection as an automatic appearance inspection device for printed wiring boards. AOI is to project light from the back of the printed circuit board, capture the light passing through the printed circuit board and read the circuit pattern, so as to find out the line defect, line thinning, pinhole, scratch, short circuit, line change that deviates from the specification. Devices with circuit defects such as roughness, copper re...

Claims

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Application Information

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IPC IPC(8): C25D7/06C25D3/38H05K1/09
CPCC25D5/028C25D3/38C25D5/16C25D7/0614C25D7/0692H05K1/09H05K3/384H05K2201/0154H05K2201/0355C25D5/627C25D5/605
Inventor 沟口美智小畠真一立冈步平冈慎哉桥口隆司
Owner MITSUI MINING & SMELTING CO LTD
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