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Fabrication process for photoresist die

A photoresist and mold technology, applied in the field of optical fiber processing, can solve the problems of affecting the uniformity of SU8 film thickness, affecting the process repeatability yield, low optical isolation, etc., so as to improve the process repeatability and yield, improve optical High isolation and high transmission efficiency

Inactive Publication Date: 2015-11-11
BEIJING ZHONGKEZIXIN TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, problems such as glue edges and stress in the SU8 production process have greatly affected its process repeatability and yield.
The optical isolation between the reaction cells in the prior art is small, and the optical crosstalk between adjacent micro-reaction cells is obvious, which will lead to the problem of signal misreading in the sequencing reaction
There are glue edges in the SU8 film obtained by the ordinary glue leveling process, and the acceleration of the termination process produces a large torsion force on the SU8 film, resulting in a central vortex, which seriously affects the uniformity of the SU8 film thickness.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] (1) Homogeneous glue;

[0031] 1) Drop the photoresist onto the center of the optical fiber panel;

[0032] 2) Set the fiber optic panel to an acceleration of 600rpm / min 2 Accelerate from standstill to 600rpm / min for 30s;

[0033] 3) At an acceleration of 4000rpm / min 2 Accelerate to 1800rpm / min for 13s;

[0034] 4) At an acceleration of 1500rpm / min 2 Accelerate to 2000rpm / min for 38s;

[0035] 5) At an acceleration of 1500rpm / min 2 Accelerate to 2200rpm / min for 30s;

[0036] 6) At a deceleration of 300rpm / min 2 Decrease the speed to 800rpm / min for 15s;

[0037] 7) Decrease the speed gradually and stop the glue rejection;

[0038] (2) Pre-baking: Place the SU8 film-coated optical fiber panel on the hot plate for pre-baking, the first stage is 60℃, 7min, the second stage is 90℃, 8min;

[0039] (3) Exposure: 365nm ultraviolet light is used for exposure, the exposure dose is 155mJ / cm 2 , The exposure time is 6min;

[0040] (4) Post-bake: Place the exposed optical fiber panel on the hot pl...

Embodiment 2

[0045] (1) Homogeneous glue;

[0046] 1) Drop the photoresist onto the center of the optical fiber panel;

[0047] 2) The fiber optic panel is accelerated at 560rpm / min 2 Accelerate from standstill to 600rpm / min for 26s;

[0048] 3) At an acceleration of 4000rpm / min 2 Accelerate to 1800rpm / min for 15s;

[0049] 4) At an acceleration of 2500rpm / min 2 Accelerate to 2000rpm / min for 39s;

[0050] 5) At an acceleration of 1000rpm / min 2 Accelerate to 2200rpm / min for 32s;

[0051] 6) At a deceleration of 300rpm / min 2 Decrease the speed to 800rpm / min for 15s;

[0052] 7) Decrease the speed gradually and stop the glue rejection;

[0053] (2) Pre-baking: Put the SU8 film-coated optical fiber panel on the hot plate before baking, the first stage is 60℃, 8min, the second stage is 90℃, 10min;

[0054] (3) Exposure: 365nm ultraviolet light is used for exposure, the exposure dose is 155mJ / cm 2 , The exposure time is 6min;

[0055] (4) Post-bake: Place the exposed optical fiber panel on the hot plate and po...

Embodiment 3

[0060] (1) Homogeneous glue;

[0061] 1) Drop the photoresist onto the center of the optical fiber panel;

[0062] 2) The fiber optic panel is accelerated at 500rpm / min 2 Accelerate from standstill to 600rpm / min for 25s;

[0063] 3) At an acceleration of 4000rpm / min 2 Accelerate to 1800rpm / min for 14.5s;

[0064] 4) At an acceleration of 1800rpm / min 2 Accelerate to 2000rpm / min for 35s;

[0065] 5) With an acceleration of 3000rpm / min 2 Accelerate to 2200rpm / min for 40s;

[0066] 6) At a deceleration of 300rpm / min 2 Decrease the speed to 800rpm / min for 15s;

[0067] 7) Decrease the speed gradually and stop the glue rejection;

[0068] (2) Pre-baking: Put the SU8 film-coated optical fiber panel on the hot plate before baking, the first stage is 60℃, 7.8min, the second stage is 90℃, 9min;

[0069] (3) Exposure: 365nm ultraviolet light is used for exposure, the exposure dose is 155mJ / cm 2 , The exposure time is 6min;

[0070] (4) Post-bake: Place the exposed optical fiber panel on the hot plate a...

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PUM

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Abstract

The invention discloses a fabrication process for a photoresist die. A photoresist spin coating method comprises the following steps of: adding photoresist to the center of an optical fiber panel dropwise; accelerating the optical fiber panel to 600 rpm / min from a standstill; accelerating the optical fiber panel to 1,800 rpm / min; accelerating the optical fiber panel to 2,000 rpm / min; accelerating the optical fiber panel to 2,200 rpm / min; decelerating the optical fiber panel to 800 rpm / min; and gradually decelerating the optical fiber panel and ending spinning. The fabrication method for the photoresist die comprises photoresist spin coating, pre-baking, exposing, post-baking, cooling, developing and hardening. By the photoresist die fabricated according to the method, the optical crosstalk between adjacent micro reaction pool arrays is reduced, and the problem of signal misreading caused by sequencing reaction is effectively solved.

Description

technical field [0001] The invention belongs to the technical field of optical fiber processing, and in particular relates to a preparation process of a photoresist mold. Background technique [0002] Photoresist, also known as photoresist, is a light-sensitive mixed liquid composed of three main components: photosensitive resin, sensitizer and solvent. The photoresist should have relatively low surface tension, so that the photoresist has good fluidity and coverage. SU8 material is a negative epoxy photoresist developed by IBM in 1995. It has high ultraviolet photosensitive properties and has been widely used in the production of MEMS such as plastic mechanical structures, microfluidic devices, and microchannel structures. SU8 is an organic polymer colloid formed by dissolving bisphenol A epoxy resin in γ-butyrolactone. It is named after eight epoxy resins in one molecule in Yinping County. The process of SU8 pyrophosphorus is mainly divided into two steps: (1) The photoi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/42
CPCG03F7/26G03F7/38G03F7/40
Inventor 陈哲张睿王者馥王绪敏殷金龙任鲁风
Owner BEIJING ZHONGKEZIXIN TECH
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