Sealing method for direct-insert type light-emitting diode (LED) lamp

A kind of technology of LED lamp and in-line technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc. It can solve the problems of uneven coloring of colloidal stirring, and achieve the effects of avoiding yellowing, improving reliability, improving quality and yield

Inactive Publication Date: 2015-11-11
苏州市英富美欣科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0018] The technical problem to be solved by the present invention is to provide a glue sealing method for in-line LED lamps, which solves the problem of uneven coloring of the colloid in the prior art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment 1

[0057] A glue sealing method for an in-line LED lamp, comprising the following steps:

[0058] Step 1. Set the height of the mold strip and the stuck point;

[0059] Step 2, select diffusing agent and coloring agent;

[0060] Step 3. After heating epoxy resin A, mix it with epoxy resin B in a weight ratio of 4:1, add a diffusing agent in a weight ratio of 10:1 according to the AB mixed glue and diffusing agent, and add coloring agent, coloring agent The weight ratio with the diffusing agent is 1:3, stirring, and the stirring time is 15 minutes;

[0061] Step 4. Check whether there is unstirred epoxy resin glue on the bottom of the mixing container or on the wall of the container. If there is, continue stirring, otherwise, go to step 5;

[0062] Step 5, vacuumizing the mixed glue after stirring, the vacuuming time is 10 minutes;

[0063] Step 6. Add the mixed glue after vacuuming to the automatic glue filling funnel and viscose funnel;

[0064] Step 7. Fix the bound LED bra...

specific Embodiment 2

[0070] A glue sealing method for an in-line LED lamp, comprising the following steps:

[0071] Step 1. Set the height of the mold strip and the stuck point;

[0072] Step 2, select diffusing agent and coloring agent;

[0073] Step 3. After heating epoxy resin A, mix it with epoxy resin B in a weight ratio of 3:1, add a diffusing agent according to the weight ratio of AB mixed glue and diffusing agent in a ratio of 13:1, and add coloring agent, coloring agent The weight ratio with the diffusing agent is 1:4, stirring, and the stirring time is 10 minutes;

[0074] Step 4. Check whether there is unstirred epoxy resin glue on the bottom of the mixing container or on the wall of the container. If there is, continue stirring, otherwise, go to step 5;

[0075] Step 5. Vacuumize the stirred mixed glue for 15 minutes;

[0076] Step 6. Add the mixed glue after vacuuming to the automatic glue filling funnel and viscose funnel;

[0077] Step 7. Fix the bound LED bracket on the loading...

specific Embodiment 3

[0083] A sealing method for an LED lamp, comprising the steps of:

[0084] Step 1. Set the height of the mold strip and the stuck point;

[0085] Step 2, select diffusing agent and coloring agent;

[0086] Step 3. After heating epoxy resin A, mix it with epoxy resin B in a weight ratio of 2:1, add a diffusing agent according to the weight ratio of AB mixed glue and diffusing agent in a ratio of 15:1, and add coloring agent, coloring agent The weight ratio with the diffusing agent is 1:2, and the stirring time is 12 minutes;

[0087] Step 4. Check whether there is unstirred epoxy resin glue on the bottom of the mixing container or on the wall of the container. If there is, continue stirring, otherwise, go to step 5;

[0088] Step 5. Vacuumize the stirred mixed glue for 13 minutes;

[0089] Step 6. Add the mixed glue after vacuuming to the automatic glue filling funnel and viscose funnel;

[0090] Step 7. Fix the bound LED bracket on the loading rack;

[0091] Step 8. Adjus...

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PUM

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Abstract

The invention discloses a sealing method for a direct-insert type light-emitting diode (LED) lamp. The sealing method comprises the following steps: firstly, setting the heights of a mold strip and a sticking point, and selecting a diffusant and a coloring agent; secondly, heating epoxy resin A, mixing the epoxy resin with epoxy resin B at a certain ratio, adding the diffusant and the coloring agent, stirring the diffusant and the coloring agent, and carrying out vacuum-pumping treatment on stirred mixed glue; thirdly, fixing the bound LED bracket on a loading rack; fourthly, adjusting the glue-pouring quantity, the glue-extruding speed, the sticking time and the sticking distance; and finally starting a pouring machine and carrying out sealing treatment on the bound LED bracket. The epoxy resin A is heated and then is mixed with the epoxy resin B at the certain ratio, so that the mixing viscosity is reduced; the diffusant and the coloring agent are added and stirred, so that the problem of yellow discoloration of the baked LED lamp is avoided by controlling the mixing ratio and the mixing time; and the quality and the yield of the LED lamp are improved, so as to improve the cost performance of an LED display screen.

Description

technical field [0001] The invention belongs to the field of LED chip packaging, and in particular relates to a glue sealing method for an in-line LED lamp. Background technique [0002] LED potting glue is an auxiliary material for LED packaging. It has high refractive index and high light transmittance. It can protect the LED chip and increase the luminous flux of the LED. It has low viscosity and is easy to degas. It is suitable for potting and molding, making the LED have Better durability and reliability. [0003] During the use of LEDs, the loss of photons produced by radiative recombination when they are emitted to the outside mainly includes three aspects: the internal structure of the chip and the absorption of materials; the reflection loss of photons at the exit interface due to the difference in refractive index; The loss of total reflection caused by the incident angle greater than the critical angle of total reflection. Therefore, a lot of light cannot exit t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/52
CPCH01L33/56H01L33/52
Inventor 孙志君方继广唐猛王国荣
Owner 苏州市英富美欣科技有限公司
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