The invention discloses an
adhesive sealing method in an LED (light-emitting
diode) encapsulating process. The
adhesive sealing method comprises the following steps of: firstly, arranging a distance measuring sensor connected to a controller on an
adhesive sealing
machine stand; then, obtaining the depth and the bowl cup mouth
caliber of an
LED lamp bowl cup; regulating the rotation speed and the
binding time of roller wheel of the adhesive sealing
machine stand according to the bowl cup depth, the bowl cup
caliber and the preset adhesive filling and sealing parameters; regulating the distance between the bracket and the roller wheel of the adhesive sealing stand; and starting an adhesive sealing
machine to perform adhesive sealing operation on the bowl cup on the bracket in sequence. The adhesive sealing method can be used for automatically regulating the rotation speed and the
binding time of the roller wheel of the adhesive sealing stand, so that the
automation degree is improved. Meanwhile, the distance between the bracket and the roller wheel and the adhesive sealing stand is automatically regulated, so that the impurities produced by
grinding off the
coating on the edge of the bowl cup by virtue of the roller wheel due to too
short distance are avoided, and a phenomenon that the bowl cup is deformed and not adhered with the adhesive due to too long distance is avoided.