Ultrafine grained Ta material and preparation method thereof

An ultra-fine grain and tantalum material technology, applied in the field of ultra-fine grain Ta material and its preparation, can solve the problems of unsuitable for industrial production of ultra-fine grain high-purity tantalum strip, affecting the performance of Ta material, introducing impurities, etc. Slip suppression, large deformation, and prevention of deformation and cracking
CN109097713AActive Publication Date: 2018-12-28CENT SOUTH UNIV +1
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Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
CENT SOUTH UNIV
Publication Date
2018-12-28

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Abstract

The invention relates to an ultrafine grained Ta material and a preparation method thereof. Grain size of the ultrafine grained Ta material is smaller than or equal to 3 mu m; ultimate strength of thematerial is higher than or equal to 410 MPa, and yield strength is higher than or equal to 300 MPa. The preparation method of the material comprises the following steps: electron beam melting is performed on a Ta source, after ingot casting, an ingot is sheathed in a protective atmosphere; 3D hot-forging cogging is performed, total deformation of cogging is 65%-75%, and cogging temperature is 1150-1250 DEG C; after cogging, a sheath is removed, and low-temperature and high-temperature cross alternate rolling is performed; the ultrafine grained Ta material is obtained. The process is simple, and the prepared Ta ribbon has uniform and quite fine grains and is endowed with favorable strength, plasticity and toughness. The designed and prepared ultrafine grained Ta ribbon is applied to the high-technology fields of electronics, metallurgy, steel, chemical industry, hard alloys, atomic energy, superconducting technology, automotive electronics, aerospace, medical health and scientific research.
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Description

technical field

[0001] The invention relates to an ultrafine-crystalline Ta material and a preparation method thereof, belonging to the technical field of design and preparation of special materials. Background technique

[0002] The density of tantalum is 16.68g / cm 3 , with a melting point of 2980°C. It has a series of excellent properties such as high melting point, low vapor pressure, good cold working performance, high chemical stability, strong resistance to liquid metal corrosion, and large dielectric constant of the surface oxide film. It is used in electronics, metallurgy, steel, and chemical industry. , Carbide, atomic energy, superconducting technology, automotive electronics, aerospace, medical and health and scientific research and other high-tech fields have important applications.

[0003] With the continuous development of the new generation of information technology and industrial technology, in order to meet the needs of deep processing, the grain size and ...

Claims

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