Sn-Zn-series lead-free brazing filler metal and preparation method thereof

A lead-free solder, sn-zn technology, used in manufacturing tools, welding equipment, metal processing equipment, etc., to achieve the effect of high joint strength, reduced oxide, excellent oxidation resistance and wettability

Inactive Publication Date: 2015-11-18
AAC MICROTECH CHANGZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no relevant report on the solder required for the connection between NdFeB magnets and low carbon steel.

Method used

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  • Sn-Zn-series lead-free brazing filler metal and preparation method thereof
  • Sn-Zn-series lead-free brazing filler metal and preparation method thereof
  • Sn-Zn-series lead-free brazing filler metal and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Take the preparation of 1000 solder as an example

[0027] Described Sn-Zn series lead-free solder, each component is respectively by weight percent:

[0028] Zn: 8%; Al: 0.005%; Nd: 0.03%; Sn: balance.

[0029] The preparation method of described Sn-Zn series lead-free solder, comprises the steps:

[0030] Step S1: Preparation of Master Alloy

[0031] Step S11: According to the weight percentage, Al is 10%, Sn is the balance, and a Sn-10Al master alloy is prepared, and the specific preparation method is as follows:

[0032] Step S111: heating the Sn and Al to 700°C, and passing in an inert gas for protection;

[0033] Step S112: After the Al is completely dissolved into the Sn, stop heating and cool down to lower the temperature to 380° C. At this time, perform stirring and slag removal to obtain the Sn-10Al master alloy melt;

[0034] Step S113: casting the Sn-10Al master alloy melt into a plate-shaped ingot to obtain the Sn-10Al master alloy.

[0035] Step S12: ...

Embodiment 2

[0046] Take the preparation of 1000 solder as an example

[0047] Described Sn-Zn series lead-free solder, each component is respectively by weight percent:

[0048] Zn: 8%; Al: 0.006%; Nd: 0.04%; Sn: balance.

[0049] The preparation method of described Sn-Zn series lead-free solder, comprises the steps:

[0050] Step S1: Preparation of Master Alloy

[0051] Step S11: According to the weight percentage, Al is 10%, Sn is the balance, and a Sn-10Al master alloy is prepared, and the specific preparation method is as follows:

[0052] Step S111: heating the Sn and Al to 750°C, and passing in an inert gas for protection;

[0053] Step S112: After the Al is completely dissolved into the Sn, stop heating and cool down to lower the temperature to 400° C. At this time, perform stirring and slag removal to obtain the Sn-10Al master alloy melt;

[0054] Step S113: pouring the Sn-10Al master alloy melt into a U-shaped channel steel to form a 5 mm thick plate-shaped ingot to obtain the ...

Embodiment 3

[0066] Take the preparation of 1000 solder as an example

[0067] Described Sn-Zn series lead-free solder, each component is respectively by weight percent:

[0068] Zn: 8%; Al: 0.006%; Nd: 0.05%; Sn: balance.

[0069] The preparation method of described Sn-Zn series lead-free solder, comprises the steps:

[0070] Step S1: Preparation of Master Alloy

[0071] Step S11: According to the weight percentage, Al is 10%, Sn is the balance, and a Sn-10Al master alloy is prepared, and the specific preparation method is as follows:

[0072] Step S111: heating the Sn and Al to 800°C, and passing in an inert gas for protection;

[0073] Step S112: After the Al is completely dissolved into the Sn, stop heating and cool down to lower the temperature to 420° C., then stir and remove slag to obtain the Sn-10Al master alloy melt;

[0074] Step S113: pouring the Sn-10Al master alloy melt into the U-shaped channel steel to form a 7 mm thick plate-shaped ingot to obtain the Sn-10Al master al...

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Abstract

The invention discloses Sn-Zn-series lead-free brazing filler metal. The Sn-Zn-series lead-free brazing filler metal consists of the following components in percentage by weight: 8-9% of Zn, 0.005-0.006% of Al, 0.005-0.15% of Nd and the balance of Sn. Compared with the prior art, the Sn-Zn-series lead-free brazing filler metal provided by the invention has relatively good oxidization resistance and wettability, and is low in melting point. The invention further discloses a preparation method for the Sn-Zn-series lead-free brazing filler metal.

Description

【Technical field】 [0001] The invention relates to the technical field of alloy materials, in particular to a Sn-Zn series lead-free solder and a preparation method thereof. 【Background technique】 [0002] As a sunrise industry of energy saving and environmental protection, NdFeB magnets have been widely used in technical fields such as information technology, automobiles, nuclear magnetic resonance, wind power generation and motors. In practical applications, NdFeB magnets need to be fixed on the carrier, and the material of the carrier is mostly low-carbon steel. The connection performance between NdFeB magnets and low-carbon steel affects the performance of the corresponding products. In related technologies, there are mainly two methods for connecting NdFeB magnets and low-carbon steel, one is glue bonding, and the other is laser welding. [0003] Among them, there is a phenomenon of glue overflow in the connection method of glue bonding. The overflow glue not only pollu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262B23K35/40B23K2103/04
Inventor 王常亮
Owner AAC MICROTECH CHANGZHOU
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