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High-thermal-conductivity polymer composite material and preparation method and application thereof

A technology of composite materials and polymers, applied in the direction of nitrogen compounds, chemical instruments and methods, inorganic chemistry, etc., can solve the problems of limited use, low thermal conductivity, and formation of thermal conductivity networks, etc., to achieve wide application, high thermal conductivity, The effect of stable thermal conductivity

Active Publication Date: 2015-11-18
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, to provide a high thermal conductivity polymer composite material and its preparation method, to solve the problem that the existing polymer / thermal ceramic composite material is difficult to form a thermal conductivity network in the polymer matrix composite material , the technical problem that it is difficult to effectively improve the thermal conductivity of polymer / heat-conducting ceramic composites
[0009] Another object of the present invention is to overcome the above-mentioned deficiencies of the prior art, and also provides the application of the high thermal conductivity polymer composite material of the present invention to solve the limited technology of the existing polymer / thermal ceramic composite material due to low thermal conductivity question

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preparation example Construction

[0031] Correspondingly, an embodiment of the present invention provides a preparation method of the above-mentioned high thermal conductivity polymer composite material. The process steps of the preparation method of the high thermal conductivity polymer composite material of the embodiment of the present invention are as follows: figure 1 As shown, it includes the following steps:

[0032]Step S01: mixing boron nitride nanosheets, water and water-soluble polymer according to the mass ratio of 1:(1-50):100 to obtain a mixture solution;

[0033] Step S02: Freeze the mixture solution prepared in step S01 to form a frozen mixture, and freeze-dry the frozen mixture to obtain a three-dimensional boron nitride precursor;

[0034] Step S03: Sintering and heat-treating the three-dimensional boron nitride precursor prepared in step S02 to obtain three-dimensional boron nitride;

[0035] Step S04: impregnating the three-dimensional boron nitride prepared in step S03 into the liquid pr...

Embodiment 1

[0058] A high thermal conductivity polymer composite material and a preparation method thereof. The high thermal conductivity polymer composite material provided in this embodiment 1 is prepared according to the following method:

[0059] S11: Mixing boron nitride nanosheets, deionized water and polyethylene glycol according to the mass ratio of 1:50:100;

[0060] S12: Freeze the mixed solution in step S11 in a refrigerator at -20°C for 12 hours to obtain a frozen mixture, and use a freeze-vacuum drying process for the frozen mixed solution with a vacuum degree of -40Pa and a freezing temperature of -50°C to obtain Three-dimensional boron nitride precursor;

[0061] S13: The high-temperature sintering operation process of the three-dimensional boron nitride precursor, the sintering temperature is 1000°C, and the sintering time is 4h, to obtain three-dimensional boron nitride;

[0062] S14: Immerse the three-dimensional boron nitride in the liquid epoxy resin system, remove a...

Embodiment 2

[0066] A high thermal conductivity polymer composite material and a preparation method thereof. The high thermal conductivity polymer composite material provided in this embodiment 2 is prepared according to the following method:

[0067] S21: Mixing boron nitride nanosheets, deionized water and polyvinyl alcohol according to the mass ratio of 1:30:100;

[0068] S22: Freeze the mixed solution in step S21 in a refrigerator at -20°C for 12 hours to obtain a frozen mixture, and use a freeze-vacuum drying process for the frozen mixed solution with a vacuum degree of -40Pa and a freezing temperature of -50°C to obtain Three-dimensional boron nitride precursor;

[0069] S23: the high-temperature sintering process of the three-dimensional boron nitride precursor, the sintering temperature is 1000°C, and the sintering time is 4h, to obtain three-dimensional boron nitride;

[0070]S24: Immerse three-dimensional boron nitride in liquid cyanate, remove air bubbles under vacuum, and hea...

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Abstract

The invention discloses a high-thermal-conductivity polymer composite material and a preparation method and application thereof. The high-thermal-conductivity polymer composite material comprises a polymer base body and three-dimensional boron nitride arranged in the polymer base body in a filling mode. The volume fraction of the three-dimensional boron nitride in the high-thermal-conductivity polymer composite material is 5-50%. According to the high-thermal-conductivity polymer composite material, the three-dimensional boron nitride is adopted to build a three-dimensional network structure in the polymer base body. A heat conductive channel is built in the polymer base body. Thus, the high-thermal-conductivity polymer composite material has a high heat conductive coefficient, the condition of the preparation method of the material is moderate and easy to control, the technology is simple, and the method is safe and environmentally friendly.

Description

technical field [0001] The invention belongs to the technical field of heat-conducting composite materials, in particular to a high-heat-conducting polymer composite material and its preparation method and application. Background technique [0002] With the rapid development of electronic technology, the power and integration of electronic devices are increasing day by day. Since 1959, the feature size of the device has been continuously reduced, and has developed from micron to submicron. At the same time, the integration has increased by 40~ The 50% high-speed increase has gradually shifted people's attention from macroscopic objects to microscale devices. Especially in recent years, the rapid development of flexible electronics has greatly promoted this research boom. In electronic equipment, a considerable part of the power loss is converted into heat, so any microelectronic component with a certain resistance is an internal heat source for the microelectronic equipment ...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/04C08L79/08C08K3/38C01B21/064
CPCC01B21/064C08K3/38C08L63/00C08L79/04C08L79/08
Inventor 孙蓉曾小亮王芳芳许建斌
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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