Metal electrode for light inlet surface of crystalline silicon heterojunction solar cell and preparation method of metal electrode
A metal electrode and solar cell technology, applied in the field of solar cells, can solve the problems of low series resistance and short-circuit current of solar cells, limit the conversion efficiency of solar cells, and unsatisfactory bonding strength of substrates, so as to improve photoelectric conversion efficiency and reduce silver consumption. The effect of reducing production cost
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Embodiment 1
[0016] Taking the double-sided heterocrystalline silicon solar cell with n-type single crystal silicon of 156mm*156mm as the substrate as an example, and combining the content of the present invention to describe specific implementation cases, the present invention will be further explained, but the present invention should not be limited by this scope of protection.
[0017] The composition of the designed metal electrodes is as follows: the width of the thin grid line is 10 microns, the thickness is 2 microns, the interval between adjacent thin grid lines is 500 microns, and the number is 156; the width of the main grid line is 0.5 mm, and the thickness is 2 microns. Micron, the number of strips is 6, arranged at equal intervals on the surface of the silicon wafer. Both sides of the substrate adopt a symmetrical metal electrode structure.
[0018] After the corresponding TCO film is deposited on both sides of the monocrystalline silicon substrate, the metal electrodes on th...
Embodiment 2
[0025] Taking the double-sided heterocrystalline silicon solar cell with n-type single crystal silicon of 156mm*156mm as the substrate as an example, and combining the content of the present invention to describe specific implementation cases, the present invention will be further explained, but the present invention should not be limited by this scope of protection.
[0026] The composition of the designed metal electrodes is as follows: the width of the thin grid lines is 20 microns, the thickness is 10 microns, the interval between adjacent thin grid lines is 1.5 mm, and the number of bars is 100; the width of the main grid lines is 1.2 mm, and the thickness is 10 microns. Micron, the number of strips is 3, arranged at equal intervals on the surface of the silicon wafer. Both sides of the substrate adopt a symmetrical metal electrode structure.
[0027] After the corresponding TCO films are deposited on both sides of the monocrystalline silicon substrate, the metal electro...
Embodiment 3
[0034] Taking the double-sided heterocrystalline silicon solar cell with n-type single crystal silicon of 156mm*156mm as the substrate as an example, and combining the content of the present invention to describe specific implementation cases, the present invention will be further explained, but the present invention should not be limited by this scope of protection.
[0035] The composition of the designed metal electrodes is as follows: the width of the thin grid lines is 2 microns, the thickness is 1 micron, the interval between adjacent thin grid lines is 100 microns, and the number of them is 780; there is no main grid line. Both sides of the substrate adopt a symmetrical metal electrode structure.
[0036] After the corresponding TCO films are deposited on both sides of the monocrystalline silicon substrate, the metal electrodes on the front and back sides are prepared according to the following process:
[0037] Step 1: Coating a layer of positive photoresist on both s...
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Abstract
Description
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