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Three-layer core-shell tight ball type MDT silicon resin and preparation method thereof

A silicone resin, compact technology, applied in the field of three-layer core-shell compact spherical MDT silicone resin and its preparation, can solve the problems of not meeting the needs of power LED packaging, relying on imports of silicone, restricting development, etc., achieving high hardness, high Excellent light transmittance and high temperature resistance

Active Publication Date: 2015-12-02
绵阳华宝鼎业科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the original epoxy resin or modified epoxy resin packaging glue cannot meet the packaging needs of power LEDs
[0004] At present, my country's LED packaging accounts for about 75% of the world's total. However, the silica gel used for high-power LED packaging is all dependent on imports, and its price is expensive, which has seriously restricted the development of my country's related industrial revolution.

Method used

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  • Three-layer core-shell tight ball type MDT silicon resin and preparation method thereof
  • Three-layer core-shell tight ball type MDT silicon resin and preparation method thereof
  • Three-layer core-shell tight ball type MDT silicon resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] A, Synthesis of three-dimensional network structure phenyl core

[0063] Put phenyltrimethoxysilane, diphenyldimethoxysilane, water, methanol and trifluoromethanesulfonic acid into a three-necked flask at a mass ratio of 30:5:9:6, and at a temperature of 50°C Stir evenly, then react for 10 hours;

[0064] B, Synthesis of 3D interlayer

[0065] After mixing the reactant obtained in step A with methyltrimethoxysilane, dimethyldimethoxysilane and vinyltrimethoxysilane in a mass ratio of 10:7, under the condition of 50°C Continue to react for 7 hours;

[0066] C, Synthesis of the three-dimensional structure of the outer reaction layer

[0067] After mixing the reactants obtained in step B with vinyl double-caps and methyl double-caps at a mass ratio of 3:5, continue to react for 5 hours at a temperature of 50°C;

[0068] D, post-processing of products

[0069] Add toluene to the reaction system obtained by the reaction in step C, then stir and extract at room temperatu...

Embodiment 2

[0072] A, Synthesis of three-dimensional network structure phenyl core

[0073] Put phenyltriethoxysilane, diphenyldiethoxysilane, water, ethanol and hydrochloric acid in a three-necked flask at a mass ratio of 70:14:33:17, and stir evenly at a temperature of 35°C , then reacted for 16 hours;

[0074] B, Synthesis of 3D interlayer

[0075] After mixing the reactant obtained in step A with methyltriethoxysilane, dimethyldiethoxysilane and vinyltriethoxysilane in a mass ratio of 20:7, the Conditions continue to react for 10 hours;

[0076] C, Synthesis of the three-dimensional structure of the outer reaction layer

[0077] After mixing the reactants obtained in step B with vinyl double-headers and methyl double-headers at a mass ratio of 3:4, continue to react for 10 hours at a temperature of 35°C;

[0078] D, post-processing of products

[0079] Add methyl double-head to the reaction system obtained in step C, then stir and extract at room temperature for about 30 minutes,...

Embodiment 3

[0082] A, Synthesis of three-dimensional network structure phenyl core

[0083] Put phenyltrimethoxysilane, diphenyldiethoxysilane, water, methanol and sulfuric acid in a three-necked flask at a mass ratio of 110:19:47:25, and stir evenly at a temperature of 75°C. Then react for 3 hours;

[0084] B, Synthesis of 3D interlayer

[0085] After mixing the reactant obtained in step A with methyltrimethoxysilane, dimethyldimethoxysilane, and vinyltriethoxysilane in a mass ratio of 40:7, at a temperature of 75°C Continue to react for 3 hours;

[0086] C, Synthesis of the three-dimensional structure of the outer reaction layer

[0087] After mixing the reactants obtained in step B with vinyl double-caps and methyl double-caps at a mass ratio of 5:7, continue to react for 3 hours at a temperature of 75°C;

[0088] D, post-processing of products

[0089] Add toluene to the reaction system obtained in step C, then stir and extract at room temperature for about 30 minutes, let stand ...

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Abstract

The invention discloses a three-layer core-shell tight ball type MDT silicon resin and a preparation method thereof. According to the invention, phenyl is connected to the side of a siloxane main chain, on the one hand, the refractive index and the high and low temperature resistance of the product are enhanced, and on the other hand, the hardness of the material is reinforced, and the impact resistance requirement of the material can be satisfied. The outside of the phenyl core is a flexible layer composed of methyl and a small amount of vinyl so as to increase the hot and cold impact resistance of the material during use. The outermost layer is a reaction layer, which is mainly composed of vinyl and methyl, and in a curing process, the material and hydrogen undergo addition reaction to form a cross-linked network. The three-layer structure is in mutual independence and has definite functions, however the layers are connected by Si-O-Si and has a synergistic effect. The three-layer core-shell tight ball type MDT silicon resin synthesized by the method provided by the invention has high refractive index, high light transmittance, high hardness, high temperature resistance and strong cementability, and can be used for high power LED and electronic product packaging.

Description

technical field [0001] The invention relates to the field of MDT silicone resin, in particular to a three-layer core-shell compact spherical MDT silicone resin and a preparation method thereof. Background technique [0002] With the implementation of the national new energy strategy, the development and application of new energy materials has become one of the key research directions in the 21st century. As the link most closely related to the market in the LED industry chain, LED packaging materials have always been a research hotspot in the new energy materials industry. [0003] With the development of power LED devices, the requirements for optical properties such as refractive index, light transmittance and mechanical properties such as hardness and bonding strength of LED packaging materials are getting higher and higher. At the same time, packaging materials also require excellent high temperature resistance and Non-yellowing properties, etc. Therefore, the original...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G77/20C08G77/06
Inventor 邓志华付俊杰邓建国纪兰香尚丽坤刘忠平马春彦黄健白小峰
Owner 绵阳华宝鼎业科技有限公司