Preparation method of diamond/aluminum composite material

An aluminum composite material and diamond technology, which is applied in the field of diamond/aluminum composite material preparation, can solve problems such as the difficulty of sintering and densification of composite heat dissipation materials, the difficulty of realizing industrial production, and the complexity of molding processes, so as to improve interface reaction kinetics, The effect of preventing high temperature oxidation corrosion and avoiding adverse effects

Active Publication Date: 2015-12-02
KUNMING UNIV OF SCI & TECH
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  • Abstract
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  • Claims
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Problems solved by technology

[0005] Among all the methods mentioned above, metal matrix alloying and diamond particle surface modification methods can achieve good interfacial bonding, but at the same time it complicates the forming process, and the adverse effects brought by the introduction of alloying elements will also limit it. Further development; the cost of pressureless infiltration and extrusion infiltration is relatively low, but its effect is not ideal; the problems of air pressure assisted infiltration and vacuum hot pressing sintering are that the preparation cost is high, the equipment is not easy to control, and it is difficult to Realize industrial production; the spark plasma sintering method is currently a relatively good method, but it still has problems such as difficulty in sintering and densifying composite heat dissipation materials with high diamond content, and expensive equipment

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  • Preparation method of diamond/aluminum composite material
  • Preparation method of diamond/aluminum composite material
  • Preparation method of diamond/aluminum composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] like figure 1 Shown, the preparation method of this diamond / aluminum composite material, its specific steps are as follows:

[0025] (1) First, 5g of diamond particles with a particle size of 80μm are washed with alkali (60ml of NaOH solution with a concentration of 10wt.% is used to boil for 30min, and rinsed with distilled water for 2 to 3 times to remove grease and other dirt on the diamond surface. Stir with a magnetic stirrer during the oiling process), roughen (use 60ml of nitric acid solution with a concentration of 30wt.% to boil for 30min, wash with distilled water 2 to 3 times to roughen the surface, increase the contact area with the substrate, and roughen the surface. During the process, a magnetic stirrer is used for stirring), and then aluminum powder (particle size is 30 μm, purity greater than 99.9%) is added according to the volume ratio of 50:50 and mixed evenly to obtain a mixed powder;

[0026] (2) Put the mixed powder obtained in step (1) into a gr...

Embodiment 2

[0028] like figure 1 Shown, the preparation method of this diamond / aluminum composite material, its specific steps are as follows:

[0029] (1) First, 5g of diamond particles with a particle size of 150μm are washed with alkali (use 60ml of NaOH solution with a concentration of 10wt.% to boil for 30 minutes, rinse with distilled water for 2 to 3 times, and remove the grease and other dirt on the diamond surface. Stir with a magnetic stirrer during the oiling process), roughen (use 60ml of nitric acid solution with a concentration of 30wt.% to boil for 30min, wash with distilled water 2 to 3 times to roughen the surface, increase the contact area with the substrate, and roughen the surface. During the process, a magnetic stirrer is used for stirring), and then aluminum powder (particle size is 80 μm, purity greater than 99.9%) is added according to the volume ratio of 70:30 and mixed evenly to obtain a mixed powder;

[0030] (2) Put the mixed powder obtained in step (1) into a...

Embodiment 3

[0032] like figure 1 Shown, the preparation method of this diamond / aluminum composite material, its specific steps are as follows:

[0033] (1) First, 5g of diamond particles with a particle size of 100μm are washed with alkali (use 60ml of NaOH solution with a concentration of 10wt.% to boil for 30min, and rinse with distilled water for 2 to 3 times to remove grease and other dirt on the surface of the diamond. Stir with a magnetic stirrer during the oiling process), roughen (use 60ml of nitric acid solution with a concentration of 30wt.% to boil for 30min, wash with distilled water 2 to 3 times to roughen the surface, increase the contact area with the substrate, and roughen the surface. During the process, a magnetic stirrer is used for stirring), and then aluminum powder (particle size is 100 μm, purity greater than 99.9%) is added according to the volume ratio of 65:35 and mixed evenly to obtain a mixed powder;

[0034](2) Put the mixed powder obtained in step (1) into a...

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Abstract

The invention relates to a preparation method of a diamond / aluminum composite material, and belongs to the technical field of microwave technology application and material powder metallurgy. Firstly, diamond particles with particle sizes of 80-150 microns are washed by alkali and roughened, and are added with aluminum powder in a volume ratio of 50-70: 50-30 for uniform mixing to obtain mixed powder; protective gas is filled in the mixed powder for microwave heating to a temperature of 200-300 DEG C with the heating speed of 5-10 DEG C / min under the condition of a pressure of 10-35 MPa for keeping 5 min and for microwave heating to a temperature of 650-750 DEG C with the heating speed of 30-50 DEG C / min for thermal pressure sintering by 0.5-1 h; and after the sintering is finished, the diamond / aluminum composite material is prepared through cooling demolding. The method can simply and efficiently realize industrialized production of the diamond / aluminum composite material with better interface bonding performance, low cost and excellent performance.

Description

technical field [0001] The invention relates to a preparation method of a diamond / aluminum composite material, which belongs to the technical fields of microwave technology application and material powder metallurgy. Background technique [0002] With the continuous development of electronic technology, the degree of integration of electronic components is getting higher and higher, and the heat generation is also increasing. Microprocessors and power semiconductor devices often cannot work normally due to high temperature during application, and heat dissipation problems It has become one of the main technical bottlenecks facing the development of the electronic information industry. New microelectronic packaging materials must not only have high thermal conductivity, but must also have a thermal expansion coefficient that matches that of semiconductor materials. The existing electronic packaging materials mainly include W / Cu, Mo / Cu, SiCp / Al, SiCp / Cu, etc., which have been...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C1/05C22C26/00C22C21/00
Inventor 彭金辉顾全超许磊夏仡张利波吴庆田
Owner KUNMING UNIV OF SCI & TECH
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