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Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate

A thermosetting, prepreg technology, used in chemical instruments and methods, synthetic resin layered products, thermoplastic polymer dielectrics, etc., can solve problems such as increasing production costs, improve insulation, improve adhesion, and improve uniformity. sexual effect

Inactive Publication Date: 2015-12-23
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above two methods all need to use special gluing equipment, which increases the production cost

Method used

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  • Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate
  • Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate
  • Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4

[0049] The composition of the solid ingredients of Examples 1-4 is shown in Table 1, and methyl ethyl ketone is used to prepare the thermosetting epoxy resin varnish used in the manufacture of copper clad laminates, in which the solid content accounts for 65%.

[0050] The copper clad substrates of Examples 1-4 were prepared according to the following preparation process:

[0051] (1) Glue making: add the solvent to the batching container, add thermosetting resin, curing agent solution and curing accelerator solution separately under stirring; after stirring for 2 hours, add fillers, continue stirring for 4-8 hours, sample the glue solution The gel time (170°C constant temperature hot plate) is 200-300 seconds.

[0052] (2) Impregnation: The reinforced material layer impregnated with glue 1 and glue 2 is passed through a vertical or horizontal impregnation machine, and the sandwich prefabricated is prepared by controlling the extrusion wheel speed, line speed, air temperature and fur...

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Abstract

The invention relates to a thermosetting resin sandwich preimpregnation body, and a copper-clad plate and a multilayer printed circuit wiring plate prepared therefrom. A middle layer of the thermosetting resin sandwich preimpregnation body contains a thermosetting resin composition with high filler content, and the outer layer of the preimpregnation body contains a thermosetting resin composition with low filler content. The copper-clad plate prepared by the preimpregnation body has relatively good adhesiveness with a metal foil, insulativity and uniform dielectric constant distribution.

Description

Technical field [0001] The invention relates to a thermosetting resin composition, as well as copper clad laminates and printed circuit wiring boards made from the thermosetting resin composition. Background technique [0002] The lead-free environmental protection requirements of the electronics industry have promoted the application of fillers in the copper clad laminate industry. The use of filler technology has become an important means to improve the performance of copper clad laminates. The development trend of fillers in the copper clad laminate industry is the continuous increase of filler content. The high content of filler ratio brings more excellent properties, such as reducing thermal expansion coefficient, improving thermal conductivity, and increasing strength. [0003] Since the surface of the filler is inert, the increase of the filler content will cause the adhesion between the metal foil and the thermosetting resin composition to decrease. Patent CN101973145 impr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00B32B17/10B32B9/04B32B15/08C08K13/04C08K7/14C08K3/24C08K3/36C08K3/04C08J5/24
CPCB32B27/08H05K1/0373H05K3/022H05K2201/026B32B2038/0076B32B2305/076D06N3/0011D06N3/103D06N3/0006D06N2201/08D06N2201/02D06N3/0022D06N3/0063B32B2260/021B32B2262/101B32B2457/08H05K1/0366B32B27/12B32B5/022B32B5/024B32B15/092B32B15/20B32B27/20B32B27/38B32B37/14B32B2260/046B32B2307/204H05K1/09H05K2201/0129
Inventor 柴颂刚
Owner GUANGDONG SHENGYI SCI TECH
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