Novel grinding material, novel grinding tool, preparing method of novel grinding material and preparing method of novel grinding tool

Abstract

The invention provides a novel grinding material, a novel grinding tool, a preparing method of the novel grinding material and a preparing method of the novel grinding tool. The preparing method of the novel grinding material includes the steps that ceramic binding agents are prepared; the novel grinding material is prepared from diamond, the ceramic binding agents and additives. The preparing method of the novel grinding tool includes the step that the novel grinding tool is prepared from the novel grinding material, binding agents and filler. The novel grinding material is efficient, resistant to abrasion, large in cutting force and good in self-sharpening performance. According to the novel grinding tool, the advantages of a ceramic-binding-agent diamond grinding tool and the advantages of other-binding-agent diamond grinding tools are combined, the disadvantages of the ceramic-binding-agent diamond grinding tool and the disadvantages of the other-binding-agent diamond grinding tools are overcome, and the novel grinding tool has the advantages of being large in grinding force, good in self-sharpening performance, high in grinding efficiency, good in impacting resistance, resistant to abrasion and the like. During grinding polishing of ceramic tiles, stone or various organic-inorganic composites, the surfaces of products grinded through plane grinding are quite smooth and quite high in smoothness.

Description

technical field [0001] The invention relates to the technical field of grinding tools, in particular to a novel abrasive, an abrasive tool and a preparation method. Background technique [0002] In the abrasive tool industry, abrasive tools using diamond as abrasive grains are widely used. Such abrasive tools often use natural or artificial diamond particles as abrasive grains, which are made by mixing, molding, and curing with resin, metal or ceramic binders. . When grinding and polishing ceramic tiles, stone or organic-inorganic composite materials, diamond abrasives using metal bonds have high strength, but it is difficult to optimize the sharpness, self-sharpening and wear resistance, and the applicability is poor; The diamond abrasive tool using resin bond has low cost and good impact resistance, but due to the poor rigidity of the resin, the bonding force between the resin and the diamond particles is poor, resulting in weak grinding force, high wear and short life of...

AI Technical Summary

Problems solved by technology

When grinding and polishing ceramic tiles, stone or organic-inorganic composite materials, diamond abrasives using metal bonds have high strength, but it is difficult to optimize the sharpness, self-sharpening and wear resistance, and the applicability is poor; The diamond abrasive tool using resin bond has low cost and good impact resistance, but due to the poor rigidity of the resin, the bonding force between the resin and the diamond particles is poor, resulting in weak grinding force, high wear and short life of the abrasive tool; ceramic bond is used High-quality diamond abrasives have high cutting force and good self-sharpening, but due to the high brittleness of ceramics, the abrasives have poor impact resistance, are easily broken, and are not safe enough.

Therefore, when grinding and polishing ceramic tiles, stone materials or organic-inorganic composite materials, there is no ideal grinding and polishing abrasive tool at present.