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Resin composition

A technology of resin composition and compound, applied in the direction of circuit substrate materials, printed circuit parts, etc., can solve the problems of crack circuit and deformation of insulating layer and conductor layer, and achieve the effect of excellent peel strength and excellent surface roughness

Active Publication Date: 2015-12-30
AJINOMOTO CO INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the trend of thinner and shorter in recent years, the number of stacked layers of printed circuit boards tends to increase, but with the increase in the number of layers, cracks or circuit deformation caused by the difference in thermal expansion between the insulating layer and the conductor layer occur. become a problem

Method used

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Examples

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Comparison scheme
Effect test

preparation example Construction

[0136] The preparation method of the resin composition of this invention is not specifically limited, For example, the method of adding a solvent etc. to a compounding component as needed, and using a rotary mixer etc. to mix and disperse etc. are mentioned.

[0137] The resin composition of the present invention can obtain a cured product (insulating layer) with a low dielectric loss factor. The dielectric loss factor of the cured product of the resin composition of the present invention can be measured by the method described in described later. Specifically, it can be measured by the cavity resonator perturbation method under conditions of a frequency of 5.8 GHz and a measurement temperature of 23°C. From the standpoint of preventing heat generation at high frequencies, reducing signal delay and signal noise, the dielectric loss factor is preferably 0.010 or less, more preferably 0.009 or less, further preferably 0.008 or less, 0.007 or less, or 0.006 or less. The lower l...

Embodiment

[0188] Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. In addition, "part" means a mass part.

[0189] 〔Measurement method, evaluation method〕

[0190] First, various measurement methods and evaluation methods will be described.

[0191]

[0192] (1) Substrate treatment of inner layer circuit board

[0193] Both sides of a glass cloth base epoxy resin double-sided copper-clad laminate (thickness of copper foil: 18 μm, thickness of substrate: 0.4 mm, “R1515A” manufactured by Panasonic Co., Ltd.) on which inner layer circuits are formed are used "CZ8101" manufactured by MEC Co., Ltd. etched 1 micrometer, and roughened the copper surface.

[0194] (2) Lamination of adhesive films

[0195]The adhesive films prepared in Examples and Comparative Examples were bonded to the inner layer circuit board with the resin composition layer using a batch-type vacuum pressure laminator (“MVLP-500” manufactured by M...

Embodiment 2

[0217] Except that the compounding amount of the carbodiimide compound ("V-03" manufactured by Nisshinbo Chemical Co., Ltd., a toluene solution with 50% by mass of non-volatile content) was changed to 80 parts, the resin varnish was produced in the same manner as in Example 1. Adhesive film.

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Abstract

The invention provides a resin composition of an insulating layer which has excellent dielectric loss factor, excellent thermal expansion coefficient, excellent elongation at break, surface roughness and peeling strength. The resin composition comprises the components of (A) epoxy resin, (B) active ester compound, (C) carbodiimide compound, (D) thermoplastic resin and (E) inorganic filling material, wherein when the nonvolatile component in the resin composition is set to 100% by mass, the content of the component (E) is above 40%.

Description

technical field technical field [0001] The present invention relates to resin compositions. Furthermore, it is related with the adhesive film, a printed wiring board, and a semiconductor device using this resin composition. Background technique [0002] As a manufacturing technique of a printed wiring board, a manufacturing method using a buildup system in which insulating layers and conductive layers are alternately stacked is known. In the manufacturing method using the stacking method, the resin composition is usually cured to form an insulating layer. For example, Patent Document 1 discloses a technique of forming an insulating layer having a low dielectric loss factor by curing a resin composition containing an epoxy resin, an active ester compound, and a carbodiimide compound. [0003] Due to the trend of thinner and shorter in recent years, the number of stacked layers of printed circuit boards tends to increase, but with the increase in the number of layers, cr...

Claims

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Application Information

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IPC IPC(8): C08L63/02C08L63/00C08L71/12C08L79/08C08L29/14C08K13/06C08K5/134C08K5/29C08K9/06C08K3/36H05K1/03
Inventor 西村嘉生巽志朗藤岛祥平渡边真俊
Owner AJINOMOTO CO INC
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