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Epoxy resins, epoxy resin compositions, prepregs, laminates and printed circuit boards containing tcpd structures

An epoxy resin and composition technology, applied in the field of laminates, can solve the problems of further improvement of heat resistance, low dielectric loss factor, low dielectric constant, etc., and achieve excellent dielectric constant, low dielectric constant, The effect of low dielectric loss factor

Active Publication Date: 2021-05-11
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The invention uses dicyclopentadiene-type benzoxazine resin combined with epoxy resin, active ester curing agent and phosphorus-containing flame retardant to make prepregs and laminates with low dielectric constant, low dielectric loss factor, low Water absorption and good flame retardancy, but its glass transition temperature can only reach 153-172°C, and the heat resistance needs to be further improved

Method used

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  • Epoxy resins, epoxy resin compositions, prepregs, laminates and printed circuit boards containing tcpd structures
  • Epoxy resins, epoxy resin compositions, prepregs, laminates and printed circuit boards containing tcpd structures
  • Epoxy resins, epoxy resin compositions, prepregs, laminates and printed circuit boards containing tcpd structures

Examples

Experimental program
Comparison scheme
Effect test

preparation example 1

[0099] Preparation example 1: the synthesis of the epoxy resin of formula I structure

[0100] Add 54.4g of phenol and toluene into a four-necked flask (500mL) equipped with a stirrer, a thermometer, and a condensing reflux device, dissolve in a water bath, weigh 1.4g of boron trifluoride diethyl ether complex, and add In the flask, add 39.6g TCPD into the dropping funnel, control the dropping speed so that all the TCPD is added dropwise within 2 hours, raise the temperature to 100-120°C, keep it warm for 5 hours, after the reaction is over, wash with water, filter, recrystallize, vacuum Dry to obtain the phenolic resin containing TCPD structure.

[0101] Put the 25g phenolic resin containing the TCPD structure obtained in the previous step into a four-necked flask, then weigh 100g epichlorohydrin and add slowly, after it dissolves, start to heat up, and add 1mol of mass fraction in the dropping funnel to be 33% NaOH solution, control the speed so that it is added dropwise wi...

preparation example 2

[0103] Preparation example 2: the epoxy resin synthesis of formula II structure

[0104] Add 136.8g of bisphenol A into a four-necked flask (500mL) equipped with a stirrer, a thermometer, and a condensing reflux device, and use toluene as a solvent, dissolve it in a water bath, weigh 1.4g of boron trifluoride etherate complex, and add In the four-neck flask, add 39.6g TCPD into the dropping funnel, control the dropping speed so that all the TCPD is added dropwise within 2 hours, raise the temperature to 100-120°C, keep it warm for 5 hours, after the reaction is over, wash with water, filter, and recrystallize , and dried in vacuum to obtain a phenolic resin containing TCPD structure.

[0105] Put the 25g phenolic resin containing the TCPD structure obtained in the previous step into a four-necked flask, then weigh 100g epichlorohydrin and add slowly, after it dissolves, start to heat up, and add a mass fraction of 1mol in the dropping funnel. 33% NaOH solution, control the sp...

preparation example 3

[0107] Preparation example 3: the epoxy resin synthesis of formula I structure

[0108] Add 108g of o-cresol and toluene as a solvent in a four-neck flask (500mL) equipped with a stirrer, a thermometer, and a condensing reflux device, dissolve in a water bath heating, weigh 1.4g of boron trifluoride diethyl ether complex, add four In the flask, add 39.6g TCPD to the dropping funnel, control the dropping speed so that all the TCPD will be added dropwise within 2 hours, raise the temperature to 100-120°C, keep it warm for 5 hours, after the reaction is over, wash with water, filter, and recrystallize. Vacuum drying to obtain the phenolic resin containing TCPD structure.

[0109]Put the 25g phenolic resin containing the TCPD structure obtained in the previous step into a four-necked flask, then weigh 100g epichlorohydrin and add slowly, after it dissolves, start to heat up, and add 1mol of mass fraction in the dropping funnel to be 33% NaOH solution, control the speed so that it...

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Abstract

The present invention relates to epoxy resins, epoxy resin compositions, prepregs, laminates and printed circuit boards containing TCPD structures. The laminate manufactured by using the epoxy resin containing TCPD structure or its resin composition of the present invention has high glass transition temperature, high thermal decomposition temperature, low thermal expansion coefficient, low dielectric constant, low dielectric loss factor and low water absorption.

Description

technical field [0001] The invention belongs to the technical field of laminated boards, and relates to an epoxy resin containing a TCPD structure, an epoxy resin composition and prepregs, laminated boards and printed circuit boards using the same. Background technique [0002] In recent years, with the development of high-performance, high-functionality and networking of information and communication equipment, in order to transmit and process large-capacity information at high speed, the operation signal tends to be high-frequency. At the same time, in order to meet the development trend requirements of various electronic products , the circuit board is developing towards the direction of high multi-layer and high wiring density, which requires the substrate material not only to have good dielectric constant and dielectric loss factor to meet the needs of high-frequency signal transmission, but also to have good heat resistance to Meet the needs of multilayer printed circu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/08C08L63/04C08L79/04B32B15/14B32B17/04B32B17/06B32B5/26
CPCB32B5/26B32B15/14B32B2260/021B32B2260/046B32B2262/02B32B2262/06B32B2262/10B32B2262/101B32B2307/306B32B2307/7265B32B2457/08C08G59/08C08K2201/003C08L63/04C08L79/04C08L2201/02C08L2201/08
Inventor 何烈相曾宪平许永静
Owner GUANGDONG SHENGYI SCI TECH
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