A kind of grinding device and grinding method of sapphire wafer

Abstract

A grinding device for a sapphire wafer according to the present invention comprises a slurry bucket, a peristaltic pump and a grinder, the grinder is provided with a slurry tank, and the slurry enters the grinder through the peristaltic pump and the slurry tank, a sapphire wafer The grinding method includes the following steps: 1. Preparation of slurry: multi-level feeding of raw materials; 2. Control of slurry flow: accurate slurry feeding; 4. Powder distribution on the surface of the grinding disc, 5. Double-sided grinding of the wafer: firstly, light pressure grinding is carried out. The feature of the present invention is that the raw material ratio of the slurry is optimized, and the supply flow rate of the slurry is more accurate. , transport more evenly, before normal grinding, first perform light pressure grinding, to prevent the cracking of the wafer during the grinding process as much as possible, reduce the chip fragmentation rate, improve the high quality rate of grinding, and the removal rate during grinding is stable , there will be no problems of over-grinding and low removal rate, and the efficiency is faster.

Description

technical field [0001] The invention relates to the field of processing sapphire substrates, in particular to a grinding device and a grinding method for a sapphire wafer. Background technique [0002] Sapphire wafer grinding is a very important process in sapphire wafer manufacturing. It determines the TTV, WARP, and surface roughness of sapphire after grinding. In the application of existing technologies, the slurry is generally stirred first, and then poured Put it into the slurry tank, use the way of slurry pump and delivery pipe to transport the slurry to the surface of the grinding disc for supply, and return the ground slurry to the slurry tank for recycling. Actually, in the process of grinding powder configuration In the process, the stirring of the slurry is often very uneven, if it is not completely stirred, the suspension of the grinding slurry is poor, and it is easy to cause wafer cracks and roughness. These chipped and cracked wafer particles will enter the sl...

AI Technical Summary

Problems solved by technology

[0002] Sapphire wafer grinding is a very important process in sapphire wafer manufacturing. It determines the TTV, WARP, and surface roughness of sapphire after grinding. In the application of existing technologies, the slurry is generally stirred first, and then poured Put it into the slurry tank, use the way of slurry pump and delivery pipe to transport the slurry to the surface of the grinding disc for supply, and return the ground slurry to the slurry tank for recycling. Actually, in the process of grinding powder configuration In the process, the stirring of the slurry is often very uneven, if it is not completely stirred, the suspension of the grinding slurry is poor, and it is easy to cause wafer cracks and roughness. These chipped and cracked wafer particles will enter the slurry and circulate It will cause the whole bucket of slurry to be used again and be wasted, the surface of the ground wafer will be scratched, and scratches will appear. In serious cases, the entire disk will burst and all the wafers will be lost. In addition, the grinding process The control is not in place, resulting in a decrease in the grinding quality rate and an increase in cost

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