Manufacturing method for composite magnetic mask plate for evaporation
A composite magnetic and manufacturing method technology, applied in vacuum evaporation plating, sputtering plating, ion implantation plating, etc., can solve the problems of not meeting the high-quality evaporation process, drooping board surface, limiting the resolution of OLED products, etc.
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Embodiment 1
[0058] combine Figure 4 , Embodiment 1 of the present invention is expanded as follows:
[0059] S1. The metal support layer is produced by electroforming, and the metal support layer 41 with a certain thickness is produced. The metal support layer 41 is provided with a specific window structure 410. The metal support layer 41 is produced by electroforming. The specific electroforming process includes: S11, substrate preparation, select an electroformed deposition substrate 40 with a clean and flat surface; S12, film sticking, press or coat a layer of photosensitive film on one surface of the deposition substrate 40 to form a photosensitive film layer 400; S13, exposure, for S12 The specific area of the photosensitive film layer 400 is exposed, and the area 401 where the photosensitive film layer is exposed is the area where the window structure 410 is located, and the photosensitive film in other areas 402 outside the window structure 410 is not exposed; S14, development, ...
Embodiment 2
[0074] As a second embodiment of the present invention, such as Figure 5 As shown, the difference from Embodiment 1 is that in Embodiment 1, each window structure 410 on the metal support layer 41 has only one opening structure 420 inside; while in this embodiment, each window structure 410 has multiple opening structures inside. Opening structure 420 .
Embodiment 3
[0076] As a third embodiment of the present invention, such as Image 6 As shown, it is different from Embodiments 1 and 2 in that the "stripping step" in Embodiments 1 and 2 is carried out after the electroforming process is completed (that is, it is completed before the step S2 of covering the surface of the metal support layer); In this embodiment, the "stripping step" (as step S5 ) is after the step of developing the photoresist film layer in S4 . Such a design method can better avoid damages such as creases on the metal support layer 41 with a thinner thickness during the mask making process.
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Abstract
Description
Claims
Application Information
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