Glass-PDMS film-glass sandwich microfluidic chip manufacturing method

A kind of PDMS and microfluidic chip technology, applied in the field of microfluidic chip design, can solve the problems of long time period, high cost, cumbersome processing process, etc., achieve high-efficiency transfer, low solvent evaporation characteristics, and solve the effect of solvent volatilization

Active Publication Date: 2016-01-13
INSPUR BEIJING ELECTRONICS INFORMATION IND
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Problems solved by technology

[0005] The technical problem to be solved in this application is to provide a method for manufacturing a glass-PDMS film-glass sandwich microfluidic chip, which solves the cumbersome processing process, long time period and relatively high cost of the sandwich PDMS microfluidic chip in the prior art. high problem

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  • Glass-PDMS film-glass sandwich microfluidic chip manufacturing method
  • Glass-PDMS film-glass sandwich microfluidic chip manufacturing method
  • Glass-PDMS film-glass sandwich microfluidic chip manufacturing method

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Embodiment Construction

[0037] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0038] refer to figure 1 , showing a flow chart of an embodiment of a method for manufacturing a glass-PDMS film-glass sandwich microfluidic chip of the present application, which may include the following steps:

[0039] Step S101: processing the structured PDMS film with the prepreg PET as a transfer sacrificial layer.

[0040] Specific process such as figure 2 Shown:

[0041] Step S201: Pouring the configured PDMS on the silicon wafer mold.

[0042] Step S202: Cover the PDMS...

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Abstract

The invention provides a glass-PDMS film-glass sandwich microfluidic chip manufacturing method. A polyester PET sheet is used as a transferring sacrificial layer to treat a structured PDMS film, and through plasma processing, the treated structured PDMS film is sandwiched between two glass substrates so that a glass-PDMS film-glass sandwich microfluidic chip is formed. Through ingeniously use of PET as a carrier for transferring a treated delicate structured PDMS film so that high efficiency transferring of the structured PDMS film is realized, a structured PDMS film manufacturing process is simplified and technology difficulty and a time cost are reduced. Through plasma processing, the structured PDMS film is sandwiched between two glass substrates so that the glass-PDMS film-glass sandwich microfluidic chip is formed. A glass material has low permeability so that the chip has low solvent volatility and the problem of PDMS microfluidic chip solvent volatilization is solved.

Description

technical field [0001] The present application relates to the field of microfluidic chip design, in particular to a method for manufacturing a glass-PDMS film-glass sandwich microfluidic chip. Background technique [0002] With the development of technology, people have higher and higher requirements for the fabrication methods of sandwich microfluidic chips. [0003] Existing sandwich microfluidic chips include sandwich PDMS microfluidic chips coated with parylene (PA), sandwich PDMS microfluidic chips coated with polyvinylidene chloride (PVDC), and polyvinylidene chloride (PVDC) coated sandwich PDMS microfluidic chips. Vinyl alcohol (PVA) film is used as a transfer sacrificial layer to make sandwich PDMS chips, but these sandwich PDMS microfluidic chips have a cumbersome processing process, a long time period, and high cost. [0004] Therefore, how to effectively realize the fabrication of the sandwich microfluidic chip, simplify the processing process, shorten the time p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B01L3/00
Inventor 王丽
Owner INSPUR BEIJING ELECTRONICS INFORMATION IND
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