Environment-friendly ecological board and production process thereof

A production process and ecological board technology, which is applied in the field of board production, can solve problems such as wave patterns, carbonized bright spots, bubbling, poor brightness of the product board surface, step marks on the substrate surface, etc., and achieve formaldehyde-free environmental protection. Adhesive strength, The effect of improving flatness and improving pass rate

Inactive Publication Date: 2016-02-03
张建明
View PDF6 Cites 11 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The outer panel of this process uses technological wood, poplar or eucalyptus. When the outer panel is poplar or eucalyptus, there are uneven defects on the surface. After hot pressing with melamine impregnated paper, this defect will appear on the finished panel. Board surface; when the outer board is made of technical wood, the hot pressing temperature should not exceed 100°C when it is hot-pressed with melamine impregnated paper. Therefore, the brightness of the product board surface is not good; It is bent in a tile shape (the bending degree of the small-diameter plate is greater), and the thickness tolerance and density difference of each core plate will also cause step marks and wavy lines on the surface of the substrate during hot pressing
Although this process optimizes the production process, it is still unable to overcome the common defects such as wavy lines, carbonization, bright spots, and bubbles on the surface of the ecological board. In addition, after the middle board and the core board are hot-pressed, the substrate blank needs to be aged to eliminate the hot-pressing stress. longer time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Environment-friendly ecological board and production process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0020] A production process of an environmentally friendly ecological board, comprising the steps of:

[0021] Step 1: Hot-press glue one side of the three-layer plywood and melamine-impregnated paper to form a melamine-impregnated paper-faced wood-based panel, let it cool down to room temperature, and wait for use; the duration of hot-pressing is 8 minutes, and the temperature is 125°C-130°C. Pressure 0.7MPa.

[0022] In practice, the duration of hot pressing in this step can be in the range of 5-15 minutes, the temperature can be between 100°C-150°C, and the pressure can be between 0.3-1.5MPa.

[0023] Step 2: Apply cold pressing glue on both sides of the substrate, and cold press with the melamine-impregnated paper-faced wood-based panel obtained in the above step 1; wherein the cold pressing glue is a water-based isocyanate adhesive, which is adjusted according to the following ratio: isocyanate adhesive 80%, curing agent 10%, flour 10%. The duration of cold pressing is ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to view more

Abstract

The invention provides an environment-friendly ecological board and a production process thereof. The production process comprises: performing hot-press gluing on one side of an artificial board and impregnated bond paper into an impregnated bond paper decorative artificial board, and cooling the impregnated bond paper decorative artificial board till a room temperature for later use, wherein hot pressing is performed for 5-15 minutes at a temperature ranging from 100 to 150 DEG C and under a pressure ranging from 0.3 to 1.5MPa; coating both sides of a substrate with a cold-pressing glue and performing cold pressing on the substrate and the obtained impregnated bond paper decorative artificial board, wherein the cold-pressing glue is a water-based isocyanate adhesive; cold pressing is performed for over 30 minutes under a pressure ranging from 0.1 to 1Mpa; relieving the pressure, and aging for 5 or more hours followed by cutting edges, thereby obtaining the finished environment-friendly ecological board. The invention provides the environment-friendly ecological board that is few in production steps and high in finished product yield and grade rate, and the production process thereof.

Description

【Technical field】 [0001] The invention belongs to the technical field of plate production, and in particular relates to an environmentally friendly ecological plate and a production process thereof. 【Background technique】 [0002] For spliced ​​boards (also known as large core boards) and oriented strand boards (OSB boards) as the substrate, there are uneven defects on the surface of the substrate due to factors such as wood defects, material differences, and dimensional tolerances. To overcome this defect and produce ecological board products with good surface flatness and high grade, the commonly used production process is as follows: Process 1: 1. The double-sided adhesive of the substrate is laminated with a layer of middle board, usually a single board with a thickness of 1.5-2.2mm. 2. If hot-pressing is used for the glue-pressed middle board, the hot-pressed slab needs to be aged for 7-10 days to reduce the hot-pressing stress of the slab. If the cold-pressing method i...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): B27D1/00B27D1/04B32B21/06B32B21/14
Inventor 张建明潘学扬
Owner 张建明
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products