Method for detecting whether materials are penetrated or not by using change of gas pressure or flow

Abstract

The invention discloses a method for detecting whether materials are penetrated or not by using change of gas pressure or flow. Whether the materials are penetrated or not can be judged stably, accurately and quickly through the real-time detection of the change of the gas pressure or the flow, so that reasonable delay time is obtained. The processing efficiency can be improved effectively through reasonable delay processing; at the same time, the processing quality is improved, and the phenomena of too large punched holes, black edges and the like caused by overburning through lasers are avoided.

Description

technical field [0001] The invention relates to a detection method, in particular to a method for quickly and accurately detecting whether a material penetrates or not by using the change of gas pressure or flow rate during laser drilling. Background technique [0002] Laser cutting and drilling is the first laser processing technology to be practical, and it is also one of the main application fields of laser processing. With the rapid development of modern industry and science and technology, more and more materials with high hardness and high melting point are used, while traditional processing methods can no longer meet certain process requirements. This type of processing task is difficult, sometimes even impossible, with conventional machining methods, but it is not difficult to achieve with laser cutting or drilling. The laser beam is highly concentrated in space and time. Using the lens to focus, the diameter of the spot can be reduced to the micron level to obtain ...

AI Technical Summary

Problems solved by technology

[0003] In the actual laser cutting or drilling processing, how to detect whether the material penetrates or not is extremely important to reasonably control the laser processing time. It not only affects the quality of processing, but also affects the efficiency of processing.

Specifically, the time required for perforation is different for materials of different thicknesses. At the same time, even for materials of the same thickness, due to the difference in material layers, the light absorption rate is different, and the time required for perforation is also very large. The difference, furthermore, it is impossible to determine an accurate piercing delay time by means of pure calculation or single observation and derivation. If the delay time is too short, it cannot guarantee that the hole will penetrate or penetrate the material, which will affect subsequent processing; If the time is too long, the effective processing time will be wasted, and the quality of material processing will also be affected, and problems such as black edges and increased processing aperture will easily appear.

[0004] In order to realize the real-time detection of whether the material penetrates or not, there are currently two methods: capacitance detection and CCD image processing. Among them, capacitance detection appeared in Germany, and its specific implementation method is to judge the penetration of the processing hole according to the weak change of capacitance. Or not, but this detection method is very susceptible to interference from environmental factors (such as ion clouds, splashes, etc.), which will produce wrong judgments and cannot guarantee reliability

CCD image processing appeared in Japan, and its specific implementation method is to analyze and judge whether the hole to be processed is penetrated or not according to the image collected by the CCD. Interference of ion clouds generated during processing, image processing is more complicated, and additional hardware CCD, optical filter, beam splitter, LED lighting, etc. are required at the same time, and the cost is very high

[0005] Because of the above two methods, there are different deficiencies, and neither of them can meet the needs of actual industrial stability, accuracy, and low cost. Therefore, in the actual processing process, in order to ensure the completion of processing, it is limited by the lack of satisfactory The real-time detection method required for actual use, most laser processing does not detect the penetration state of the material in real time, only the delay method is used, that is, prolonging the laser action time to ensure the penetration or penetration of the hole, the processing efficiency is low, and the processing High cost and poor processing effect

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