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Palladium electroplating solution containing tetraphenylarsonium bromide and electroplating method of palladium electroplating solution

A technology of tetraphenyl arsenium bromide and diamino palladium dibromide is applied in the field of palladium electroplating solution containing tetraphenyl arsenium bromide, and can solve the problem of wire adhesion and solder wettability decrease, palladium plating layer The thickness is difficult to control and the current efficiency of the plating solution is low, so as to achieve the effect of good coating quality, excellent plating solution performance and high cathode current efficiency

Inactive Publication Date: 2016-02-10
WUXI JIABANG ELECTRIC POWER PIPE FACTORY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problems encountered in the application of the coating are: (1) The thickness of the palladium coating is difficult to control, and the internal stress tends to increase with the increase of the coating thickness, so it is difficult to obtain sufficient ductility
(2) Decreased wire adhesion and solder wettability after palladium plating heat treatment
Although the process is relatively simple, the current efficiency of the plating solution is low, the performance of the plating solution is poor, and the quality of the coating is not good.

Method used

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  • Palladium electroplating solution containing tetraphenylarsonium bromide and electroplating method of palladium electroplating solution
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  • Palladium electroplating solution containing tetraphenylarsonium bromide and electroplating method of palladium electroplating solution

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Experimental program
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Effect test

Embodiment 1

[0029] The formulation of the electroplating solution is as follows:

[0030]

[0031] Plating process conditions: the pulse width of the single pulse square wave current is 2ms, the duty cycle is 30%, and the average current density is 2A / dm 2 ; The pH is 7.5, the temperature is 45°C, and the electroplating time is 9 minutes.

Embodiment 2

[0033] The formulation of the electroplating solution is as follows:

[0034]

[0035] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 2.5A / dm 2 ; The pH is 7.5, the temperature is 45°C, and the electroplating time is 5min.

Embodiment 3

[0037] The formulation of the electroplating solution is as follows:

[0038]

[0039] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 3A / dm 2 ; The pH is 8.5, the temperature is 55°C, and the electroplating time is 6 minutes.

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Abstract

The invention discloses a palladium electroplating solution containing tetraphenylarsonium bromide and an electroplating method of the palladium electroplating solution. The palladium electroplating solution comprises 5-20 g / L of trans-diamido-palladous bromide in terms of palladium, 60-90 g / L of ammonium bromide, 70-100 g / L of diammonium hydrogen phosphate, 2-5 g / L of 3-pyridine sulphonic acid and 1-4 mg / L of the tetraphenylarsonium bromide. According to the palladium electroplating solution, the trans-diamido-palladous bromide serves as main palladium salt, the tetraphenylarsonium bromide serves as antioxidants, and the dipicolinic acid serves as brightening agent salt, so that the obtained electroplating solution is high in dispersion force and deep-plating capacity, the efficiency of cathode currents is high, and the performance of the electroplating solution is excellent. By the adoption of the electroplating solution, the porosity of a coating obtained through electroplating under the alkaline condition is low, the brightness is high, and the quality of the coating is good.

Description

technical field [0001] The invention relates to the technical field of electroplating palladium, in particular to a palladium electroplating solution containing tetraphenylarsenium bromide and an electroplating method thereof. Background technique [0002] Palladium is a chemically stable noble metal material similar to gold. The coating has excellent corrosion resistance, wear resistance and electrical properties. Palladium is cheaper than gold, so the coating has been applied to electronic components such as electrical contacts, connectors, IC lead frames and printed boards that replace gold. middle. The problems encountered in the application of the coating are: (1) the thickness of the palladium coating is difficult to control, and the internal stress tends to increase with the increase of the coating thickness, so it is difficult to obtain sufficient ductility. (2) The wire adhesion and solder wettability of the palladium plating after heat treatment are reduced. Wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/50C25D5/18
Inventor 徐德生
Owner WUXI JIABANG ELECTRIC POWER PIPE FACTORY
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