Palladium electroplating solution containing sodium nitrite and tetraphenylarsonium bromide and electroplating method thereof

A technology of tetraphenyl arsenium bromide and sodium nitrite, applied in the field of palladium electroplating solution, can solve the problems of decreased wire adhesion and solder wettability, difficult to control the thickness of palladium coating, difficult to obtain ductility, etc. The effect of good coating quality, excellent bath performance and low porosity

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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The problems encountered in the application of the coating are: (1) The thickness of the palladium coating is difficult to control, and the internal stress tends to increase with the increase of the coating thickness, so it is difficult to obtain sufficient ductility
(2) Decreased wire adhesion and solder wettability after palladium plating heat treatment
Although the process is relatively simple, the current efficiency of the plating solution is low, the performance of the plating solution is poor, and the quality of the coating is not good.

Method used

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  • Palladium electroplating solution containing sodium nitrite and tetraphenylarsonium bromide and electroplating method thereof
  • Palladium electroplating solution containing sodium nitrite and tetraphenylarsonium bromide and electroplating method thereof
  • Palladium electroplating solution containing sodium nitrite and tetraphenylarsonium bromide and electroplating method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The formulation of the electroplating solution is as follows:

[0030]

[0031] Plating process conditions: the pulse width of the single pulse square wave current is 2ms, the duty cycle is 30%, and the average current density is 2A / dm 2 ; The pH is 7.5, the temperature is 45°C, and the electroplating time is 9 minutes.

Embodiment 2

[0033] The formulation of the electroplating solution is as follows:

[0034]

[0035] Plating process conditions: the pulse width of single pulse square wave current is 0.6ms, the duty cycle is 25%, and the average current density is 2.5A / dm 2 ; The pH is 7.5, the temperature is 45°C, and the electroplating time is 5min.

Embodiment 3

[0037] The formulation of the electroplating solution is as follows:

[0038]

[0039] Plating process conditions: the pulse width of single pulse square wave current is 0.8ms, the duty cycle is 20%, and the average current density is 3A / dm 2 ; The pH is 8.5, the temperature is 55°C, and the electroplating time is 6 minutes.

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Abstract

The invention discloses a palladium electroplating solution containing sodium nitrite and tetraphenylarsonium bromide and electroplating method thereof. The electroplating solution comprises 5 to 20g/L of cis-diammineplatinum dichloride, 60 to 90g/L of ammonium bromide, 2 to 5g/L of 3-pyridylsulfonic acid, 1 to 4mg/L of tetraphenylarsonium bromide, and 10 to 30g/L of sodium nitrite, on the basis of palladium. According to the palladium electroplating solution, cis-diammineplatinum dichloride is used as the main salt of palladium, tetraphenylarsonium bromide is used as an antioxidant, and sodium nitrite is used as brightener salt, so that the obtained electroplating solution is high in dispersion force and deep plating performance, high in catholic current efficiency, and outstanding in electroplating solution performance; an electroplating layer obtained by electroplating through the electroplating solution in an alkaline condition is low in porosity, high in brightness, and high in quality.

Description

technical field [0001] The invention relates to the technical field of electroplating palladium, in particular to a palladium electroplating solution containing sodium nitrite and tetraphenylarsenium bromide and an electroplating method thereof. Background technique [0002] Palladium is a chemically stable noble metal material similar to gold. The coating has excellent corrosion resistance, wear resistance and electrical properties. Palladium is cheaper than gold, so the coating has been applied to electronic components such as electrical contacts, connectors, IC lead frames and printed boards that replace gold. middle. The problems encountered in the application of the coating are: (1) the thickness of the palladium coating is difficult to control, and the internal stress tends to increase with the increase of the coating thickness, so it is difficult to obtain sufficient ductility. (2) The wire adhesion and solder wettability of the palladium plating after heat treatmen...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D3/50C25D5/18
Inventor 徐德生
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