Electromagnetic nozzle based on MEMS process

Abstract

The invention relates to an electromagnetic nozzle based on an MEMS process. The electromagnetic nozzle based on the MEMS process comprises a conducting coil, a soft magnetic material, a silicon material, a control chip, a conducting fluid and an electrode pair, wherein the conducting coil is arranged in the soft magnetic material, the silicon material coats the soft magnetic material, the positive electrode and the negative electrode of the conducting coil are respectively connected with the positive electrode and the negative electrode of the electrode pair, the control chip is arranged at the top of the silicon material, the conducting fluid flows out of the bottom of a spray hole penetrating through the control chip, the silicon material and the soft magnetic material, and the electrode pair is connected with the control chip at the top after penetrating through the soft magnetic material and the silicon material, thereby achieving micro-flowing control on the conducting fluid. After the micro electromagnetic nozzle manufactured based on the MEMS process is electrified, the conducting coil in series connection generates a magnetic field, the electrode pair generates an electric field, and an electromagnetic force formed by an electromagnetic field drives the conducting fluid in the nozzle to vertically flow downwards; the electromagnetic nozzle based on the MEMS process has the characteristics of simple structure, high precision and frequency, low noise, low heat and high reliability.

Description

technical field [0001] The invention relates to an electromagnetic spray head based on MEMS technology, which has no noise, no heat, no vibration and no driving mechanism, and is applied in the field of micro-flow control of conductive fluid with high precision, high frequency and high reliability. Background technique [0002] The MEMS manufacturing process is a general term for microstructure processing processes down to the nanometer scale and up to the millimeter scale. Mainly include: integrated circuit process technology (processing silicon materials with thin film deposition, patterning and etching technologies to form silicon-based MEMS devices), LIGA technology (photolithography, electroforming and plastic casting to form deep microstructures to manufacture MEMS device). The main feature of silicon MEMS processing technology is that the deep etching of silicon substrate materials can obtain movable microstructures with large longitudinal dimensions. Silicon process...

AI Technical Summary

Problems solved by technology

[0006] Thermal bubble print head is prone to chemical changes at high temperature and its properties are unstable, so the color authenticity will be affected to a certain extent; ink is ejected through air bubbles, and the directionality and size of ink particles are not easy to grasp , the edge of the printing line is easy to be uneven, which affects the printing quality to a certain extent

The micro piezoelectric print head is damaged or blocked, and the whole printer needs to be repaired; under high-frequency jetting, the piezo jet will make a lot of noise

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