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Single-component organosilicon heat-conducting glue and preparation method thereof

A technology of silicone and thermally conductive adhesives, applied in the field of thermally conductive adhesives, can solve problems such as poor high temperature oxidation resistance and flame retardancy, and achieve the effects of excellent high temperature oxidation resistance, good flame retardancy, and improved thermal conductivity.

Active Publication Date: 2016-03-02
深圳市安斯尔电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this invention also has the problems of high temperature oxidation resistance and poor flame retardancy

Method used

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  • Single-component organosilicon heat-conducting glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] One-component silicone heat-conducting adhesive, by weight, is made of the following components: 30 parts of alkoxy-terminated polysiloxane, 1.5 parts of methyl hydrogen-containing polysiloxane, 0.6 parts of rare earth coupling agent, 0.9 parts of platinum catalyst, 0.1 parts of acetylenic alcohols, 9.5 parts of POE, 0.3 parts of zinc stearate, 2640.8 parts of anti-aging agent, 24 parts of magnesium oxide, and 36 parts of chromium carbide.

[0027] The steps of its preparation method are as follows:

[0028] (1) Magnesium oxide and chromium carbide were added into distilled water and stirred for 20 minutes to obtain a suspension with a mass concentration of 10%, and the rare earth coupling agent was dispersed in dehydrated alcohol and ultrasonically treated for 30 minutes to obtain a modified solution. Add liquid to the suspension and stir in a water bath at 100°C for 25 minutes, filter and wash after discharge, dry in a vacuum oven at 110°C to constant weight, and obta...

Embodiment 2

[0032] One-component silicone heat-conducting adhesive, in parts by weight, is made of the following components: 40 parts of alkoxy-terminated polysiloxane, 1 part of methyl hydrogen-containing polysiloxane, 0.8 parts of rare earth coupling agent, 0.6 parts of platinum catalyst, 0.2 parts of acetylenic alcohols, 9 parts of NBR, 0.4 parts of zinc stearate, 2641 parts of anti-aging agent, 20 parts of magnesium oxide, and 39 parts of chromium carbide.

[0033] The steps of its preparation method are as follows:

[0034] (1) Magnesium oxide and chromium carbide were added into distilled water and stirred for 20 minutes to obtain a suspension with a mass concentration of 10%, and the rare earth coupling agent was dispersed in dehydrated alcohol and ultrasonically treated for 30 minutes to obtain a modified solution. Add liquid to the suspension and stir in a water bath at 100°C for 25 minutes, filter and wash after discharge, dry in a vacuum oven at 110°C to constant weight, and ob...

Embodiment 3

[0038] One-component silicone heat-conducting adhesive, in parts by weight, is made of the following components: 35 parts of alkoxy-terminated polysiloxane, 1.4 parts of methyl hydrogen-containing polysiloxane, 1 part of rare earth coupling agent, 0.5 parts of platinum catalyst, 0.1 parts of acetylenic alcohols, 8.8 parts of POE, 0.2 parts of zinc stearate, 2640.7 parts of anti-aging agent, 25 parts of magnesium oxide, and 40 parts of chromium carbide.

[0039] The steps of its preparation method are as follows:

[0040] (1) Magnesium oxide and chromium carbide were added into distilled water and stirred for 20 minutes to obtain a suspension with a mass concentration of 10%, and the rare earth coupling agent was dispersed in dehydrated alcohol for 30 minutes to obtain a modified liquid, and the modified The solution was added to the suspension and stirred in a water bath at 100°C for 25 minutes, filtered and washed after discharging, dried in a vacuum oven at 110°C to constant...

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Abstract

The invention provides single-component organosilicon heat-conducting glue. The single-component organosilicon heat-conducting glue comprises the following components in parts by weight: 30-40 parts of polysiloxane, 1-1.5 parts of a cross-linking agent, 0.5-1 part of a coupling agent, 0.5-1 part of a catalyst, 0.1-0.3 parts of an inhibitor, 8-10 parts of a flexibilizer, 0.2-0.5 parts of a stabilizing agent, 0.5-1 part of an antioxidant, 20-30 parts of magnesium oxide and 30-40 parts of chromium carbide. The invention also provides a preparation method of the single-component organosilicon heat-conducting glue. The single-component organosilicon heat-conducting glue has good thermal conductivity, high temperature oxidation-resistance and flame resistance.

Description

Technical field: [0001] The invention relates to a heat-conducting adhesive, in particular to a one-component silicone heat-conducting adhesive and a preparation method thereof. Background technique: [0002] With the rapid development of integration technology and assembly technology, the volume of electronic components and logic circuits has been reduced by thousands and tens of thousands of times, which puts forward higher requirements for the heat dissipation of materials. At present, the contact conduction of heat sinks is generally used to effectively dissipate heat from electronic components. The heat dissipation effect is determined by the connection method between the heat sink and the electronic components. The connection method generally includes mechanical fastening and thermally conductive adhesive bonding. The biggest problem in mechanical fastening is that there is a gap between the heat sink and the electronic components, the conduction effect is not good, an...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08L83/05C08K13/06C08K5/098C08K3/22C08K3/14
Inventor 李晓明
Owner 深圳市安斯尔电子有限公司